Novel semiconductor thermoelectric power generation chip structure

Abstract

The invention provides a novel semiconductor thermoelectric power generation chip structure, which comprises a heat source, thermoelectric power generation chips and a temperature balancing body, wherein the heat source is fixed at a hot end of the first thermoelectric power generation chip or on the surface of the temperature balancing body; and the second thermoelectric power generation chip is at least fixed on at a cold end of the first thermoelectric power generation chip or on the surface of the temperature balancing body. The novel semiconductor thermoelectric power generation chip structure can change the shape of a module according to the application environment as a stable and efficient thermoelectric power generation module, is not affected by the installation space and shape, can be individually or integrally applied to a plurality of fields of solar power generation, industrial waste heat power generation, air-conditioner exhaust heat power generation, air energy power generation, automobile waste heat utilization, terrestrial heat and the like and is wide in application field and good in market prospect.

Description

technical field [0001] The invention relates to a device for generating electricity using semiconductor thermoelectric power generation chips, in particular to a novel thermoelectric power generation structure in which a plurality of thermoelectric power generation chips are simultaneously superimposed and generated by setting a temperature equalizing body. Background technique [0002] Thermoelectric power generation chip is a kind of chip that uses the petier effect and Seebeck effect of semiconductor materials to generate electricity by energizing both ends of the P-type and N-type semiconductor materials to absorb heat and release heat, or to provide a temperature difference between the two ends of the P-type and N-type semiconductor materials. A semiconductor device made of technology. It does not require chemical reaction and has no mechanical moving parts, so it has the advantages of energy saving and environmental protection, small size, simple structure, no noise, f...

AI Technical Summary

Problems solved by technology

It is fixed with sealant, but its thermal conductivity is low, which will easily cause thermal resistance between the surfa

Images