A terahertz quantum cascade laser gain spectrum measurement device and its manufacturing method
A technology of quantum cascade and manufacturing method, which is applied in laser parts, lasers, phonon exciters, etc., can solve the problems of unmeasured THzQCL gain spectrum changes, etc., to improve the average waveguide loss, improve the threshold gain, improve the The effect of optical power
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Embodiment 1
[0091] Such as Figure 3 to Figure 12 As shown, the present invention provides a terahertz quantum cascade laser gain spectrum measurement device and a manufacturing method thereof, the gain spectrum measurement device comprising:
[0092] Semi-insulating GaAs substrate 1a;
[0093] a GaAs buffer layer 2 located on the upper surface of the semi-insulating GaAs substrate 1a;
[0094] An n-type heavily doped lower contact layer 4 located on the surface of the GaAs buffer layer 2;
[0095] The active region 5 located on the surface of the n-type heavily doped lower contact layer 4;
[0096] An n-type heavily doped upper contact layer 6 located on the surface of the active region 5;
[0097] The first, second, and third upper electrode metal layers 7a, 7b, and 7c located on the surface of the n-type heavily doped upper contact layer 6 and separated from each other, the first upper electrode metal layer 7a and the second upper electrode metal layer A deep isolation groove 9 rec...
Embodiment 2
[0139] Such as Figure 13 to Figure 20 As shown, the present invention provides a terahertz quantum cascade laser gain spectrum measurement device and a manufacturing method thereof, the gain spectrum measurement device comprising:
[0140] doped GaAs substrate 1b;
[0141] a bonding metal layer 3 located on the upper surface of the doped GaAs substrate 1b;
[0142] An n-type heavily doped lower contact layer 4 located on the surface of the bonding metal layer 3;
[0143] The active region 5 located on the surface of the n-type heavily doped lower contact layer 4;
[0144] An n-type heavily doped upper contact layer 6 located on the surface of the active region 5;
[0145] and the first, second, and third upper electrode metal layers 7a, 7b, and 7c located on the surface of the n-type heavily doped upper contact layer 6 and separated from each other, the first upper electrode metal layer 7a and the second A deep isolation groove 9 recessed to the bonding metal layer is pro...
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