A high-power electronic component circuit board with high heat dissipation performance and its manufacturing method

Abstract

The invention discloses a large-power electronic component circuit board with high heat dissipation performance. The large-power electronic component circuit board comprises a circuit board, large-power electronic components, radiating fins and heat conduction layers. The radiating fins are arranged at the two ends of two large-power electronic components with the same polarity and cover the surfaces of large-power electronic components. The invention further discloses a manufacturing method of a large-power electronic component circuit board with high heat dissipation performance. According to the invention, the structure is concise, the two ends of the two large-power electronic components with the same polarity on the circuit board are fixed so that currents generated by a circuit in the circuit board are shunted and heat generated in the circuit is transferred, the contact area between the radiating fins and air is increased, and the heat dissipation performance is improved; and the radiating fins cover the surfaces of the large-power electronic components, a conventional heat dissipation mode is changed, the space in the circuit board, occupied by the radiating fins is reduced, the utilization rate of the space in the circuit board is improved, the radiating fins can be assembled by use of machine patch mounting, the production efficiency is enhanced, and the production cost is decreased.

Description

technical field [0001] The invention belongs to the technical field of circuit board heat dissipation, and in particular relates to a high-power electronic component circuit board with high heat dissipation performance and a manufacturing method thereof. Background technique [0002] With the rapid development of science and technology, it has promoted the rapid improvement of electronic circuit technology. In the current application of electronic circuits, some high-power electronic components are usually installed on the circuit board, and these high-power electronic components generate a large amount of heat energy during operation. If the heat energy generated cannot be dissipated from the circuit board and high-power electronic components in time , leading to the accumulation of heat energy, prone to overheating of circuit boards or electronic components, affecting the performance of circuit boards, and in severe cases, damaging high-power electronic components or circu...

AI Technical Summary

Problems solved by technology

It is not conducive to the miniaturization of products and reduces the profits of enterprises