Unlock instant, AI-driven research and patent intelligence for your innovation.

A high-temperature-resistant high-power and high-current printed circuit board and its preparation method

A printed circuit board, high-power technology, applied in the direction of printed circuits, printed circuits, circuit heating devices, etc., can solve the problems of inconsistent thermal expansion and contraction coefficients between metal heat sinks and substrates, difficult heat transfer, poor heat dissipation, etc. , to achieve lower temperature, excellent heat dissipation performance, and reduced thickness

Active Publication Date: 2019-03-05
SHENZHEN BOMIN ELECTRONICS
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the above method is used to dissipate heat for printed circuit boards with high heat dissipation requirements. Since the thermal expansion and contraction coefficients of the metal heat dissipation block and the substrate are inconsistent, it is easy to fall off, separate or crack the substrate.
In addition, the distance between the metal heat sink and the circuit is far away, the heat is difficult to transfer to the metal heat sink, and the heat dissipation effect is not good

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A high-temperature-resistant high-power and high-current printed circuit board and its preparation method
  • A high-temperature-resistant high-power and high-current printed circuit board and its preparation method
  • A high-temperature-resistant high-power and high-current printed circuit board and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] This embodiment provides a high-power and high-current printed circuit board with high temperature resistance, such as figure 1 , Including a layer of insulating substrate 1, a circuit layer 2 is provided on the insulating substrate 1, a through hole penetrating the insulating substrate 1 is provided under the circuit layer 2, and a metal heat dissipation base block 3 is provided in the through hole. An insulating film 4 is provided between the heat dissipation base block 3 and the circuit layer 2; a plurality of concentric circular grooves 5 are provided at both ends of the metal heat dissipation base block.

[0030] Further, the metal heat dissipation base block is in the shape of a quadrangular prism, and its thickness is smaller than that of the insulating substrate.

[0031] Furthermore, the side surface of the metal heat dissipation base block is provided with a concave arc surface 6; the metal heat dissipation base block is in interference fit with the through hole.

Embodiment 2

[0033] This embodiment provides a high-power and high-current printed circuit board with high temperature resistance, such as figure 1 , Including a layer of insulating substrate 1, a circuit layer 2 is provided on the insulating substrate 1, a through hole penetrating the insulating substrate is provided under the circuit layer 2, and a metal heat dissipation base block 3 is provided in the through hole. An insulating film 4 is provided between the base block 3 and the circuit layer 2; a plurality of concentric circular grooves 5 are provided at both ends of the metal heat dissipation base block.

[0034] Further, the metal heat dissipation base block is cylindrical, and its thickness is smaller than that of the insulating substrate.

[0035] Furthermore, the side surface of the metal heat dissipation base block is provided with a concave arc surface 6; the metal heat dissipation base block is in interference fit with the through hole.

[0036] The insulating film in this embodimen...

Embodiment 3

[0038] This embodiment provides a high-power and high-current printed circuit board with high temperature resistance, including a layer of insulating substrate, a circuit layer is arranged on the insulating substrate, and a through hole penetrating the insulating substrate is arranged under the circuit layer. A metal heat dissipation base block is arranged in the metal heat dissipation base block, and an insulating film is arranged between the metal heat dissipation base block and the circuit layer; two ends of the metal heat dissipation base block are provided with a plurality of concentric circular grooves.

[0039] The insulating film in this embodiment is a PVC layer of 0.3 mm.

[0040] Further, the metal heat dissipation base block is cylindrical, and its thickness is smaller than that of the insulating substrate.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a high-temperature-resistance large-power intense-current printed circuit board and a manufacturing method thereof.The printed circuit board is good in heat dissipation performance, a metal heat dissipation base block is high in bonding strength with the printed circuit board and not prone to disengagement, and the printed circuit board is particularly suitable for manufacturing large-power electronic equipment such as automobile batteries.

Description

Technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a high-power and high-current printed circuit board capable of resisting high temperatures and a preparation method thereof. Background technique [0002] With the rapid development of the electronic information industry, the upgrading of electronic products is accelerating, the speed of digital operations is getting faster and faster, the signal frequency is getting higher and higher, and the characteristics of high current resistance and high temperature resistance are required. Especially the circuit board used for battery control of new energy vehicles, the circuit has a strong current passing through it, and the temperature of the circuit board rises rapidly under long-term work. If the circuit board is not radiated in time, the circuit board will be damaged. The heat dissipation is mainly achieved through the following three methods: 1. Press a metal heat sink on ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0201H05K2201/068H05K2201/10416
Inventor 王强黄建国徐缓王飞徐正武林明建
Owner SHENZHEN BOMIN ELECTRONICS