PCB board half hole forming process

A PCB board and hole forming technology, which is applied to the formation of electrical connections of printed components, printed circuits, electrical components, etc., can solve the problem of unstable deburring effect of half-holes, uncompetitive cost and delivery time, and prolonged half-hole milling time to avoid material offset deformation, save process steps, and reduce machining paths

Active Publication Date: 2018-12-04
PLOTECH TECH KUNSHAN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method uses the ink to support the inner side of the copper plating, so the section can reduce the half-hole burr when milling the half-hole; however, this method adds two processes, increases the cost of the ink, and the viscosity of the ink is variable, which leads to unstable deburring effect of the half-hole , so the practical application is not ideal
[0006] ②The second method is to use the milling cutter and reverse turning and milling. This method is more convenient for the half-hole operation in a row; but because the forming path is doubled, the time for milling the half-hole is greatly extended. , the cost and delivery time are not competitive
However, this method has shortcomings in actual operation: the plated through hole and the empty hole are partially intersected. When drilling the empty hole, the plated through hole will affect the deformation of the material, which in turn will cause the position of the empty hole to be inaccurate, resulting in new The problem

Method used

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  • PCB board half hole forming process
  • PCB board half hole forming process
  • PCB board half hole forming process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Such as figure 1 As shown, a PCB half-hole forming process, the steps include:

[0044] ① Production of film: Carry out CAM design of circuit film and solder mask film according to the original design drawing, in which the line width of the CAM design circuit is 10% wider than the original design drawing, and the diameter of the CAM design welding mask window is 20% larger than the original design drawing. At the same time, the image of the solder mask image designed by CAM compensates for the overlapping part of the line-solder mask that is larger than the range of the pad 42, such as Figure 8 ;

[0045] ②Drilling the plated through hole 2a: drill a plated through hole 2a with a diameter D on the boundary 1a between the removed area 11 and the reserved area 12 of the circuit board;

[0046] ③ Drill pilot hole 3a: drill out pilot hole 3a away from plated through hole 2a in circuit board 1 removal area 11, pilot hole 3a diameter D1=0.7D, as figure 2 ;

[0047] ④ El...

Embodiment 2

[0058]① Production of film: Carry out CAM design of line film and solder mask film according to the original design drawing, wherein the line width of the CAM design circuit is 20% wider than the original design drawing, and the diameter of the CAM design welding mask opening is 30% larger than the original design drawing. At the same time, the image of the solder mask image designed by CAM compensates for the overlapping part of the line-solder mask that is larger than the range of the pad 42, such as Figure 9 ;

[0059] ② Drilling: drill a plated through hole 2a with a diameter of D on the boundary 1a between the removed area 11 and the reserved area 12 of the circuit board, and drill a guide away from the plated through hole 2a in the removed area 12 of the circuit board 1 Hole 3a, guide hole 3a diameter D1=0.7D, as figure 2 ;

[0060] ③Electroplating: Copper film 4 is plated on the surface of the circuit board;

[0061] ④ Circuit transfer: Apply exposure ink on the ci...

Embodiment 3

[0069] Such as Figure 6 As shown, the difference from Embodiment 2 is that the drill bit 71 for drilling plated through holes drills through the circuit board 1 , and then the drill bit 72 for drilling pilot holes drills through the circuit board 1 . Because the plated through hole 2a is a hole that actually needs to be reserved, and the guide hole 3a is a hole that will be eliminated, so the position accuracy of the plated through hole 2a is required to be higher, and it needs to be drilled out first. After the plated through-hole drill bit 71 drills through the circuit board 1 first, the circuit board 1 can be released from stress and returned to be flat, so that the circuit board 1 will not be broken due to excessive force at the same time when the pilot hole 3a is drilled.

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PUM

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Abstract

The invention belongs to the technical field of manufacturing of printed circuit boards, and relates to a PCB half hole forming process. The steps are sequentially through hole drilling and plating, guide hole drilling, breaking hole drilling and milling. The guide hole is firstly drilled to be expanded into the breaking hole, material offset deformation is avoided, the processing step number is not increased but a burr problem can be well solved, and the circuit board hole drilling qualified rate is improved. At the same time, about half of the machined paths are reduced, and effects of saving the technological steps and improving the production efficiency are realized.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a PCB half-hole forming process with high yield. Background technique [0002] The half hole is cut in half on the basis of the plated through hole. It is located on the edge of the printed circuit board. It not only retains the conduction function of the original plated through hole, but also uses the half hole wall for welding and fixing, realizing the board The simple and high-strength fixing to the board or parts is widely used. [0003] The traditional semi-hole plate manufacturing process is: image transfer→graphic plating→film removal→etching→solder mask→surface coating→half hole and shape are formed at the same time. This kind of half hole is formed by cutting the circular plated through hole in half directly after the circular plated through hole is formed. Due to the better ductility of the copper in the hole and the pulling caused by mechan...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42H05K3/00
CPCH05K3/0047H05K3/42H05K2201/0919H05K2201/095H05K2203/0221H05K2203/0242
Inventor 赖荣祥
Owner PLOTECH TECH KUNSHAN CO LTD
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