Vinyl polycarbosilane modified phenol-formaldehyde adhesive and preparation method thereof

A technology of vinyl polycarbosilane and phenolic adhesives, applied in adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve problems such as high brittleness, low peel strength, and poor toughness. Achieve excellent high temperature oxidation resistance, high activity, high specific modulus effect

Inactive Publication Date: 2016-07-27
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention aims to solve the technical problems of high brittleness, poor toughness and low peel strength in existing phenolic adhesives, and provides a vinyl polycarbosilane modified phenolic adhesive and a preparation method thereof

Method used

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  • Vinyl polycarbosilane modified phenol-formaldehyde adhesive and preparation method thereof
  • Vinyl polycarbosilane modified phenol-formaldehyde adhesive and preparation method thereof
  • Vinyl polycarbosilane modified phenol-formaldehyde adhesive and preparation method thereof

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specific Embodiment approach 1

[0015] Embodiment 1: In this embodiment, a vinyl polycarbosilane modified phenolic adhesive is prepared from phenol, formaldehyde, an alkaline catalyst, vinyl polycarbosilane and ethyl acetate.

specific Embodiment approach 2

[0016] Specific embodiment two: the preparation method of a kind of vinyl polycarbosilane modified phenolic adhesive described in specific embodiment one is specifically carried out according to the following steps:

[0017] 1. Weigh 80-100 parts of phenol, 80-100 parts of formaldehyde, 1-5 parts of basic catalyst and 1-18 parts of vinyl polycarbosilane by mass;

[0018] 2. Mix the phenol, formaldehyde, basic catalyst and vinyl polycarbosilane weighed in step 1 evenly to obtain a mixed solution;

[0019] 3. Stir the mixed liquid obtained in step 2, control the stirring speed to 400-500r / min, the reaction temperature is 90-95°C, react for 6h, drop to room temperature, then distill under reduced pressure until the system temperature reaches 105°C, stop the decompression Distill, add ethyl acetate, prepare a solution with a mass concentration of 70%, and complete a preparation method of a vinyl polycarbosilane modified phenolic adhesive.

specific Embodiment approach 3

[0020] Embodiment 3: This embodiment is different from Embodiment 2 in that the mass concentration of phenol in step 1 is ≥99.6%. Others are the same as in the second embodiment.

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Abstract

The invention relates to a vinyl polycarbosilane modified phenol-formaldehyde adhesive and a preparation method thereof. The invention aims at solving the technical problems of existing phenol-formaldehyde adhesive that fragility is high, toughness is poor and peel strength is low. The vinyl polycarbosilane modified phenol-formaldehyde adhesive is prepared from phenol, formaldehyde, an alkaline catalyst, vinyl polycarbosilane and ethyl acetate. The preparation comprises the following steps of: firstly weighing phenol, formaldehyde, alkaline catalyst and vinyl polycarbosilane; secondly, mixing raw materials; and thirdly, carrying out reaction and pressure distillation, and preparing solution. According to the invention, vinyl polycarbosilane with excellent heat resistance is grafted with POSS modified phenol-formaldehyde adhesive for preparing phenol-formaldehyde adhesive with high heat resistance, and adhesion of ceramic materials and high temperature resistant metal materials is met. The preparation method provided by the invention is used for preparing the vinyl polycarbosilane modified phenol-formaldehyde adhesive.

Description

technical field [0001] The invention relates to a phenolic adhesive and a preparation method thereof. Background technique [0002] Phenolic adhesives have good heat resistance, chemical corrosion resistance and electrical insulation properties, and are one of the earliest developed high temperature resistant adhesives. However, pure phenolic adhesives have high brittleness, poor toughness, and low peel strength. Most of the widely used high-temperature resistant phenolic adhesives are modified phenolic adhesive systems, and modified phenolic adhesives have become a research hotspot in recent years. Contents of the invention [0003] The invention aims to solve the technical problems of high brittleness, poor toughness and low peel strength in the existing phenolic adhesive, and provides a vinyl polycarbosilane modified phenolic adhesive and a preparation method thereof. [0004] A vinyl polycarbosilane modified phenolic adhesive is prepared from phenol, formaldehyde, a b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/28C09J161/14
CPCC08G8/28C09J161/14
Inventor 曹先启王勃史晓萍樊慧娟李博弘王东旭关悦瑜梁西良陈泽明王超
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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