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A kind of high temperature release film and its production process

A high-temperature release film and production process technology, applied in the direction of layered products, synthetic resin layered products, lamination, etc., can solve the problems of contamination of circuit boards, high price, precipitation of silicone oil, etc., and achieve high mechanical strength and fluidity. Good, increase the effect of stability

Active Publication Date: 2018-01-23
久裕电子科技(江苏)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to achieve the above functions, the current release film products do not fully have the above functions. The general method is to evenly coat a very thin layer of silica gel release agent on the surface of the release film. During use, silicone oil will be precipitated and pollute the circuit. board; while foreign related products are technically blocked and expensive

Method used

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  • A kind of high temperature release film and its production process
  • A kind of high temperature release film and its production process
  • A kind of high temperature release film and its production process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Embodiment 1: as figure 1 A high-temperature release film shown, the mass fraction of each component in the outer film is as follows: PBT polybutylene terephthalate 68%, PA66 polyamide resin 27%, AX8900 resin 5%; the middle layer The mass fraction of each component in the film is as follows: PBT polybutylene terephthalate 78%, LDPE low-density polyethylene 22%; In the described high-temperature release film, the thicknesses of the upper and lower outer films are respectively 30% of the total thickness of the release film, and the thickness of the middle layer film is 40% of the total thickness of the release film.

Embodiment 2

[0030] Embodiment 2: as figure 1 A high-temperature release film shown, the mass fraction of each component in the outer film is as follows: PBT polybutylene terephthalate 72%, PA66 polyamide resin 23%, AX8900 resin 5%; the middle layer The mass fraction of each component in the film is as follows: PBT polybutylene terephthalate 82%, LDPE low-density polyethylene 18%; In the described high-temperature release film, the thicknesses of the upper and lower outer films are respectively 30% of the total thickness of the release film, and the thickness of the middle layer film is 40% of the total thickness of the release film.

Embodiment 3

[0031] Embodiment 3: as figure 1 A high-temperature release film shown, the mass fraction of each component in the outer film is as follows: PBT polybutylene terephthalate 70%, PA66 polyamide resin 25%, AX8900 resin 5%; the middle layer The mass fraction of each component in the film is as follows: PBT polybutylene terephthalate 80%, LDPE low-density polyethylene 20%; In the described high-temperature release film, the thicknesses of the upper and lower outer films are respectively 30% of the total thickness of the release film, and the thickness of the middle layer film is 40% of the total thickness of the release film.

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Abstract

The invention discloses a high-temperature release film and a production technology thereof. The high-temperature release film is formed by combining two outer films and a middle film, wherein each outer film comprises an upper layer and a lower layer; the middle film is arranged between the upper outer film and the outer film; the outer film is prepared from the following components by mass fractions: 68-72% of PBT polybutylene terephthalate, 23-27% of PA66 polyamide resin, and 5% of compatilizer; the middle film is prepared from the following components by mass fractions: 78%-82% of PBT polybutylene terephthalate and 18%-22% of LDPE low-density polyethylene; the thicknesses of the upper film, the lower film and the middle film in the high-temperature release film are 30% of total thickness of the release film respectively; and the thickness of the middle film is 40% of total thickness of the release film. The release film disclosed by the invention has the characteristics of high temperature resistance, good release effect, no pollution in the laminating process and the like through reasonable distribution of the components and grasp of the technology; the qualified rate of an FPC flexible circuit board is effectively improved; the cost is reduced; and meanwhile, the clean production requirements of the FPC flexible circuit board are met, and the application prospect is wide.

Description

technical field [0001] The invention relates to the field of auxiliary equipment for the production of flexible circuit boards, in particular to a high-temperature release film suitable for the production of flexible circuit boards and a production process thereof. Background technique [0002] Flexible circuit boards, also known as "FPC flexible boards", are printed circuits made of flexible insulating substrates, and have many advantages that rigid printed circuit boards do not have. For example, it can be freely bent, wound, and folded, and can be arranged arbitrarily according to the requirements of the spatial layout, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. The use of FPC flexible boards can greatly reduce the volume of electronic products, and is suitable for the development of electronic products in the direction of high density, miniaturization, and high reliabi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L67/02C08L77/06C08L23/08C08L23/06B32B27/08B32B37/10B32B27/34
CPCB32B27/08B32B27/34B32B37/10C08J5/18C08J2367/02C08J2423/06C08J2477/06C08L67/02C08L2201/08C08L2203/16C08L2203/20C08L2205/03C08L2205/08C08L2207/066C08L77/06C08L23/0884C08L23/06
Inventor 牛军强詹浩周学军陈百怀
Owner 久裕电子科技(江苏)有限公司