A substrate and mobile terminal

Abstract

The invention relates to the field of electronic technology and discloses a substrate and a mobile terminal. The substrate has electrical patterns and multiple components. The substrate also includes: a resin layer and a thin resin layer. The components are embedded in the resin layer and the end faces of the legs are flush with the surface of the resin layer; the thin resin layer is attached to the resin layer. On the exposed side of the component's legs, a thin resin layer is provided with a through hole corresponding to each leg. The circuit pattern is attached to the side of the thin resin layer facing away from the resin layer, and the circuit pattern is connected to each through hole and connected to the leg. Pads for electrical connections. In the above technical solution, the device pad surfaces in the same direction are all on the same plane, and the thin resin is pressed together; the requirement for the device to have the same depth from the pad to the copper layer is solved, while reducing the need for pad size and pad spacing. requirements, which facilitates processing, thereby improving the effect of circuit patterns during connection, and solving the problems of rational overall module layout and product miniaturization and thinning.

Description

technical field [0001] The present invention relates to the field of electronic technology, in particular to a substrate and a mobile terminal. Background technique [0002] At present, the main purpose of adopting ECP technology in the industry is to improve product performance and higher integration; to develop in the direction of thinner and smaller product requirements. Embedded substrate: According to the substrate / PCB processing technology and component assembly characteristics, a new packaging technology that embeds components in the substrate / PCB; it improves product integration and reduces module dimensions; at the same time, it can improve product reliability. and electrothermal performance. [0003] However, in the prior art, when multiple devices are embedded in the same resin layer in the normal ECP processing flow, when multiple devices are applied to the embedded substrate, due to the different heights of the multiple devices, the buried structure in the prio...

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Problems solved by technology

[0003] However, in the prior art, when multiple devices are embedded in the same resin layer in the normal ECP processing flow, when multiple devices are applied to the embedded substrate, due to the different heights of the multiple devices, the buried structure in the prior art is difficult to guarantee The copper layer on the surface of the substrate has the same height from the pad of the device, which leads to different depths of the holes that need to be opened when the device is connected. In the production process, the processing depth of each hole is different, which greatly affects the substrate. The work efficiency during processing, and due to the difference in the embedding depth of the components, the size of the pads when the components are connected to the electrical pattern is different, and when the electrical pattern is formed, the connection effect between the component and the electrical pattern is affected.

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