7 results about "Electrical pattern" patented technology

The present invention provides a PCB having a hole-shaped boss hole for fixing a PCB substrate, the PCB having an electrical pattern arranged along the inner side surface portion of the boss hole. Through the present invention, a conventional PCB is utilized as is, and an allowable current can be ensured according to an increase in energy density even in an environment in which physical / spatial restrictions gradually occur.

The present invention provides a PCB having boss holes in the shape of holes for fixing the PCB substrate, and having an electrical pattern arranged along the inner surface of the boss holes. As a result, the present invention makes it possible to utilize conventional PCBs as they are and ensure the allowable current by increasing the energy density even in environments where physical and spatial constraints are increasingly imposed.

The invention discloses a power equipment early warning monitoring system and method, and relates to the technical field of power equipment monitoring, and the method comprises the steps: collecting the index data of target power equipment, and carrying out the preprocessing of the index data, and obtaining multi-dimensional electrical characteristic parameters; performing digital conversion on the non-electrical characteristics of the power equipment, and constructing an electrical pattern portrait representing the power utilization state of the equipment in combination with the multi-dimensional electrical characteristic parameters; machine identification is carried out on the electric pattern portrait based on a trained AI model, dynamic load identification and power real-time decomposition are realized, and power consumption behaviors are mined; based on equipment historical data, real-time working conditions and environmental parameters, a safety threshold value is dynamically adjusted, monitoring data and the safety threshold value are compared in real time, and an alarm is triggered according to the standard exceeding condition; the method has the advantages of strong anti-interference capability, dynamic threshold adjustment and accurate behavior identification.

A circuit board includes a base substrate and an electrical pattern. The electrical pattern is arranged on the base substrate and includes a plurality of conductive patterns and a plurality of connection pads. Each conductive pattern is electrically connected to at least one connection pad. The electrical pattern is composed of a first conductive layer and / or a second conductive layer, wherein the second conductive layer covers a side of the first conductive layer away from the base substrate and two sides of the first conductive layer in the extension direction thereof. The electrical pattern further includes at least one of a first protective layer and a second protective layer, wherein the first protective layer and the second protective layer are used for improving the oxidation resistance of the electrical pattern. Either of the first protective layer and the second protective layer can form a second intermetallic compound with solder.

Disclosed is a PCB having a boss hole formed in a hole shape for fixing a PCB substrate, in which an electrical pattern is provided along an inner side portion of the boss hole. Thus, a conventional PCB can be utilized without any change even in increasingly restricted physical and spatial environments, and an allowable current can be ensured as the energy density increases.

An electrode device for biostimulation and biodata collection, according to the present invention, comprises: a base unit including at least one type of polymer material; an electrical pattern unit formed on the upper surface of the base unit and including at least one wiring pattern and at least one electrode pattern; an insulating layer covering at least the electrical pattern unit; and an electrode exposure unit formed in the insulating layer to expose the electrode pattern to the outside.

The invention discloses a semiconductor device and a manufacturing method thereof, and electronic equipment, and relates to the technical field of semiconductors, and a metal connecting hole (3) adopted in the semiconductor device has a relatively small resistance value and relatively high reliability. The semiconductor device comprises a substrate (10), and a lower conductive pattern (1), an upper conductive pattern (2), a lower dielectric layer (11), an upper dielectric layer (12) and a metal connecting hole (3) which are arranged on the substrate (10). Wherein the lower dielectric layer (11) and the upper dielectric layer (12) are located between the lower conductive pattern (1) and the upper conductive pattern (2), the metal connecting hole (3) is located in the two dielectric layers, and the lower conductive pattern (1) and the upper conductive pattern (2) are electrically connected through the metal connecting hole (3). The metal connection hole (3) comprises a first metal column (31), and the bottom of the first metal column (31) is in contact with the lower conductive pattern (1). A bonding layer (a1) is arranged between the first metal column (31) and the upper dielectric layer (12), and the first metal column (31) is in contact with the lower dielectric layer (11).