A method of making a circuit

Abstract

The invention provides a circuit fabrication method. The circuit fabrication method comprises the following steps of S1, preparing a carrier, and forming a compact thin film on the surface of the carrier, wherein the carrier is made of a macromolecular compound added with an interface processing agent; S2, carrying out selective radiation exposure on the carrier according to a circuit shape needed to be fabricated so as to form a radiation region on the surface of the carrier, wherein the compact thin film on the radiation region is damaged; S3, carrying out activating processing on the radiation region by a chemical agent, and carrying out metal activation and metal ion reduction on the radiation region; and S4, electroplating or chemical plating the radiation region to form a metal circuit. According to the method, the interface processing agent is added to the macromolecular compound to fabricate the carrier, the electroplating or chemical plating of a product is facilitated to form the metal circuit, and a metal compound or a metal medium or a hydrophobic agent is not needed; when the fabricated circuit is an antenna product, the radio frequency performance of an electronic circuit cannot be affected by the carrier product fabricated according to the method, the process is simple, and the rejection ratio and the cost are both relatively low.

Description

technical field [0001] The invention relates to the technical field of electronic circuits, in particular to a circuit manufacturing method. Background technique [0002] At present, there are several ways to directly make circuits on plastic parts: [0003] 1. Method 1: Use a plastic (or polymer compound) injection molding product containing a certain catalyst, and then expose the metal in the required area by laser, and perform electroless plating or electroplating based on these exposed metal catalysts Get the circuit. The disadvantage is that this method increases the cost due to the need to add a metal catalyst to the plastic particles, and because the product contains metal, in some occasions such as antenna products, the metal catalyst may have an adverse effect on the radio frequency performance. [0004] 2. Method 2: Add a hydrophobic agent to ordinary plastic products (or ordinary polymer compounds), selectively irradiate the required parts with laser light, and ...

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a method for making a circuit to solve the problems of high cost, complex process, and the need to use metal compounds or metal catalysts or hydrophobic agents that are easy to affect metal deposition and influence in the existing circuit production technology. problems with the performance of circuits made

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