Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electromagnetic heating type hot-pressing and cold-pressing integrated multi-cavity laminating machine

An integrated lamination machine technology, applied in the manufacture of electrical components, printed circuits, multi-layer circuits, etc., can solve the problems of inability to do cold pressing process, large pressure error, large shrinkage ratio between the surface layer and the inner layer, etc., and achieve maintenance And low cost of maintenance and replacement, real-time and accurate temperature control, and the effect of improving product quality

Inactive Publication Date: 2016-08-10
SUZHOU JIAMING MACHINERY MFG
View PDF5 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main disadvantages of the existing PCB board laminator are: the heating method adopted by most of the existing laminator is electric heating rod heating or hot kerosene heating, the service life is short, the maintenance is difficult, the thermal hysteresis is large, and it is difficult to accurately control temperature; the traditional copper foil conductive heating press machine is only a hot press machine, which can only be used for hot pressing process and cannot be used for cold pressing process. During the pressing process, it is easy to cause serious warping and deformation of PCB board products, which will eventually lead to a high yield rate of PCB boards. Low, high production cost; in the traditional cold pressing process, the temperature change of the middle layer product is small, resulting in relatively large shrinkage between the surface layer and the inner layer of the PCB board product, resulting in deformation and warping of the PCB board, resulting in certain scrapping and increased scrapping Cost; in the existing voltage machine, using one cavity to work will easily lead to uneven thickness of the PCB board after lamination or the risk of lamination bubbles. The more lamination layers, the greater the cumulative pressure error, and the problem will also more obvious

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electromagnetic heating type hot-pressing and cold-pressing integrated multi-cavity laminating machine
  • Electromagnetic heating type hot-pressing and cold-pressing integrated multi-cavity laminating machine
  • Electromagnetic heating type hot-pressing and cold-pressing integrated multi-cavity laminating machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0053] The present invention will be further described in detail below in conjunction with the accompanying drawings, and the aforementioned and other objects, features, aspects and advantages of the present invention will become more apparent, so that those skilled in the art can implement them with reference to the description.

[0054] refer to figure 1 and Figure 20 According to the multi-cavity hot press 100 of the present invention, a PCB board package 160 to be pressed is placed in each pressing chamber 154b, and each PCB board package 160 to be pressed is formed by stacking at least one PCB board in sequence, in order To prevent the PCB boards from sticking during the pressing process, a thermally conductive and anti-stick partition 161 is provided between two adjacent PCB boards and between the PCB board and the pressing board 154 . In one embodiment, two press-fit chambers 154b are provided in the multi-chamber heat press 100, and a PCB package 160 to be pressed is...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an electromagnetic heating type hot-pressing and cold-pressing integrated multi-cavity laminating machine. The multi-cavity laminating machine comprises a laminating chamber with a certain internal space, a laminating assembly arranged in the laminating cavity and a hydraulic apparatus externally connected with the laminating assembly, wherein the laminating assembly comprises at least three laminating plates; the laminating plates are parallel two by two, and a certain distance is formed between the adjacent two laminating plates to form at least two laminating cavities; the driving part of the hydraulic apparatus is used for supplying laminating pressure to the laminating assembly; and an electromagnetic heating assembly and a cooling assembly are arranged in the laminating chamber. According to the electromagnetic heating type hot-pressing and cold-pressing integrated multi-cavity laminating machine provided by the invention, the uniformity and stability of temperature transfer can be improved in the hot-pressing and cold-pressing processes so as to reduce the deformation rate of the PCB in the laminating process, reduce the reject rate and improve the rate of finished products.

Description

technical field [0001] The invention relates to a multi-cavity lamination machine for PCB boards, and more specifically, to an electromagnetically heated cold-heating integrated multi-cavity lamination machine. Background technique [0002] PCB board (Printed circuit board), also known as printed circuit board or printed circuit board, is a provider of electrical connections for electronic components. Generally speaking, a printed circuit board: a layer / two layers of copper foil (conductive layer) is covered on a non-conductive substrate-called a single / double-sided circuit board, and then the designed circuit is printed by printing. Print the lines to be kept (corrosion-resistant medium) on the copper foil, immerse in the corrosive liquid to corrode the copper foil without protective coating, wash off the corrosive residual liquid, position and punch holes, apply flux, etc., It's done. The role of the PCB board is like the need for crops to grow in the soil: one is to pro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/46
CPCH05K3/46H05K2203/068
Inventor 沈金明
Owner SUZHOU JIAMING MACHINERY MFG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products