Processor heat-conduction and anti-ageing material for computer and preparation method of material

Abstract

The invention discloses a processor heat-conduction and anti-ageing material for a computer and a preparation method of the material. The processor heat-conduction and anti-ageing material for the computer comprises a base body and a reinforcement body. The base body comprises polypropylene modified silicone grease and copper powder. The reinforcement body comprises pentaerythritol, ethyl acetate grafted copolymer starch, titanium dioxide, calcium chloride powder, melamine and sucrose polyester. The material is prepared from, by weight, 30-45 parts of polypropylene modified silicone grease, 15-25 parts of copper powder, 12-16 parts of pentaerythritol, 5-10 parts of ethyl acetate grafted copolymer starch, 5-10 parts of titanium dioxide, 2-8 parts of calcium chloride powder, 10-15 parts of melamine and 2-6 parts of sucrose polyester. The heat-conduction and anti-ageing performance of a processor material for the computer is remarkably improved by optimizing the processor heat-conduction and anti-ageing material for the computer. The heat conduction rate of the prepared processor heat-conduction and anti-ageing material for the computer is 7.8-9.2 W / m.K, and tensile strength and breaking elongation are not remarkably changed under artificial accelerated ageing (90 DEG C, 90 d).

Description

Technical field [0001] The invention relates to the technical field of polymer materials, in particular to a thermally conductive aging-resistant material for a computer processor and a preparation method thereof. Background technique [0002] As the performance requirements for processors in the market are getting higher and higher, the corresponding silicon chip-level power consumption is also increasing. The heat dissipation problem needs to be solved urgently. According to statistics, processor failures caused by overheating account for 60% of the total number of processor failures. %; The ideal state of the thermal conductive material to exert the best thermal conductivity is close contact with the heat source, but due to the limitation of processing accuracy, there are actually many gaps between the contact surfaces of the two, and thermal conductive silicone grease has good fluidity properties. Therefore, as a new type of thermally conductive thermal interface material, it...

AI Technical Summary

Problems solved by technology

[0002] As the performance requirements of processors in the market are getting higher and higher, the power consumption of corresponding silicon chips is also increasing, and the problem of heat dissipation needs to be solved urgently. According to statistics, processor failures caused by overheating account for 60% of the total number of processor failures. %; The ideal state for the heat conduction material to exert the best heat conduction effect is to be in close contact with the heat source, but due to the limitation of processing accuracy, there are actually many gaps between the contact surfaces of the two, and the heat conduction silicone grease has good fluidity performance. Therefore, as a new type of heat-conducting thermal interface material, it is widely used to fill the gap between the processor and the heat sink; the thermal-conducting silicone grease will dry out and lose after many cycles of cold and heat, and aging will occur. Low, phase change energy storage is poor