In-situ test system for testing thermal-electric-force coupling performance of green electronic packaging material

Abstract

The invention relates to an in-situ test system for testing thermal-electric-force coupling performance of a green electronic packaging material. Through coupled load of a thermal-electric-force field and in-situ observation of microscopic damage evolution, a problem that a process of a microscopic defect leading to macroscopic performance degradation cannot be determined due to different observation scale is solved, thereby achieving expression on mechanical performances of the electronic packaging material under an actual extreme operation status. The system can obtain the mechanical performances of the green electronic packaging material in situ in real time under a thermal-electric-force coupling condition and also can record and obtain the microscopic damage evolution characters of the material on a telephoto optical microscope. The problem that the process of the microscopic damage leading to the macroscopic performance degradation cannot be determined due to the different observation scale is solved. Through application of a thermal filed, an electric field and a force field on a test sample at the same time, expression on the mechanical performances of the electronic packaging material under the actual extreme operation status is achieved.

Description

technical field [0001] The invention belongs to the testing technology of electronic packaging materials, relates to the thermal-electrical-force multi-field coupling testing technology of lead-free solder in electronic packaging materials in the environment of -55°C to 150°C, and in particular relates to a thermal-electrical-force testing technique for green electronic packaging materials. In situ testing system for force coupling performance. Background technique [0002] Electronic packaging is an assembly method that mechanically fixes an electronic chip to a circuit board by soldering materials while ensuring electrical connectivity. With the continuous development of miniaturization of electronic equipment and the upgrading of electronic chip manufacturing technology, the size and pitch of electronic chips on circuit boards become smaller and smaller, which will be accompanied by larger current density, more Joule heat and More severe mechanical stress due to thermal ...

AI Technical Summary

Problems solved by technology

Therefore, existing single-physics or dual-physics-based macroscopic solder test methods cannot accurately assess the reliability of future electronic packaging structures

[0005] To sum up, there are at least some defects in the existing technology, such as weak function, small scope of application, long test time, and inability to accurately characterize component response.

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