Smart liquid for stripping photoresist
A photoresist and liquid technology, applied in the processing of photosensitive materials, non-ionic surface active compounds, anionic surface active compounds, etc., can solve the problems of high cost and complex free radical processing technology
Active Publication Date: 2020-04-14
智能液体有限公司
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- Summary
- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0027] The complex machining process that generates free radicals, the necessary process control management and the distribution of materials also lead to high costs
[0028] Likewise, for metal liftoff, it is difficult to peel the coating from the substrate
Method used
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Embodiment 1
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[0091]
Embodiment 2
[0093] raw material Weight fraction [wt%] softened water 39.45 diacetone alcohol 14.00 ethyl acetoacetate 25.00 Oil 3.00 2-phenylethanol 3.75 Alkyl ethoxylates 12.00 lauryl sulfate 2.80 Total 100.00％
[0094]
[0095]
[0096] All heterogeneous systems had turbidity in the range of greater than 0 to less than or equal to 200 NTU. Turbidity can be maintained in a wide temperature range from 10°C to 95°C. Turbidity can be easily measured using a nephelometer, for example, a Hach 2100 nephelometer well known to those skilled in the art.
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The present invention relates to a novel cleaning agent based on a multiphase system, the use of the cleaning agent for removing photoresist coatings from surfaces, and a method for removing photoresist coatings from surfaces. According to the invention, the multiphase system is particularly suitable for removing coatings, photoresist coatings, polymer layers, dirt layers, insulating layers and metal layers from surfaces.
Description
technical field [0001] The present invention describes novel cleaners based on multiphase systems, the use of the cleaners for removing photoresist coatings from surfaces and methods for removing photoresist coatings from surfaces. Background technique [0002] The multiphase system according to the invention is particularly suitable for removing coatings, photoresist coatings, polymer layers, dirt layers, insulating layers and metal layers from surfaces. [0003] Manufacturing silicon wafers starts with a disk-shaped wafer made from a single crystal of silicon. The wafer is approximately 1mm thick. Circuits, wires, and electronic components are layered from these wafers. Depending on the specific product desired, the manufacturing process requires hundreds of processing steps, with some steps repeated multiple times. [0004] In order to coat the silicon surface of the wafer with the desired structure, the surface is first oxidized with steam. The oxide layer structures...
Claims
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IPC IPC(8): C11D17/00C11D11/00C11D3/20C11D3/32
CPCC11D3/2041C11D3/2072C11D3/2093C11D3/32C11D17/0013C11D11/0047C11D1/02C11D1/38C11D1/66C11D1/88G03F7/42C11D1/146C11D1/75C11D1/83C11D3/2044C11D3/2075C11D17/0017H01L21/0272H01L21/31058H01L21/321
Inventor D·舒曼
Owner 智能液体有限公司
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