Solder composition and electronic substrate using the same

A technology of composition and solder, which is applied in the direction of welding/cutting medium/material, assembly of printed circuit with electrical components, welding medium, etc., can solve the problems of solder balls, soldering part corrosion, dripping, etc., and achieve excellent wettability, Effect of inhibiting outflow and inhibiting corrosion

Active Publication Date: 2016-10-12
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when an activator such as an organic acid is added, the wettability of the solder tends to increase, but there is also a problem that corrosion easily occurs on the soldered part.
In addition, due to the micronization of the solder powder, there is also a problem that solder balls and dripping due to heating are likely to occur.
As mentioned above, with the micronization of solder powder, there are various problems, and there is no solder composition that can satisfy all these requirements

Method used

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  • Solder composition and electronic substrate using the same
  • Solder composition and electronic substrate using the same
  • Solder composition and electronic substrate using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0108] Rosin-based resin 36% by mass, thixotropic agent 6% by mass, solvent A 30% by mass, solvent B 14.9% by mass, activator A 0.1% by mass, activator D 0.5% by mass, activator E 0.5% by mass, activator 6% by mass of F, 3% by mass of activator G, 1% by mass of activator H, and 2% by mass of antioxidant were put into a container and mixed using a planetary mixer to obtain a flux composition.

[0109] Then, 11% by mass of the obtained flux composition and 89% by mass of the solder powder (100% by mass in total) were put into a container and mixed using a planetary mixer to prepare a solder composition.

Embodiment 2～5

[0111] A solder composition was obtained in the same manner as in Example 1 except that various materials were mixed in the composition shown in Table 1.

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Abstract

The invention provides a solder composition comprising a solder flux composition and a solder powder (E). The solder flux composition comprises a rosin-based resin (A), an activator (B), a thixotropic agent (C), and a solvent (D), wherein the component (B) contains a polycarboxylic acid (B1) having a melting point between 160 DEG C or higher and 220 DEG C or lower and having three or more carboxyl groups per molecule.

Description

technical field [0001] The present invention relates to a solder composition and an electronic substrate using the solder composition. Background technique [0002] In recent years, as electronic devices have become lighter, thinner and shorter, the miniaturization of printed wiring boards has progressed, and the miniaturization of mounting components mounted on printed circuit boards has also progressed. In order to join such fine components with a fine pitch, it is required to pulverize the solder powder (for example, the average particle diameter is 20 μm or less). [0003] However, if the average particle size is small, the specific surface area increases, and the amount of oxides generated on the surface of the solder powder also increases accordingly. In order to melt and remove oxides generated on the surface of solder powder, a solder composition containing a flux component having a high reducing power is required. Publication No. 2006-110580). [0004] However, w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/362H05K3/34
CPCB23K35/3613B23K35/362H05K3/3485H05K3/3489
Inventor 中路将一石垣幸一中村步美
Owner TAMURA KK
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