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Electromagnetic shielding film

A technology of electromagnetic shielding film and conductive adhesive layer, which is applied in the fields of magnetic field/electric field shielding, electrical components, layered products, etc., and can solve the problem of electromagnetic shielding film taking into account solder resistance, adhesive strength, and metal layer fracture of electromagnetic shielding film at the same time , Electromagnetic shielding film is easy to delaminate and other problems, to achieve the effect of high adhesion, excellent solder resistance, excellent corrosion resistance

Inactive Publication Date: 2016-10-12
胡银坤
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The electromagnetic shielding film has a strong filling ability and can be used in the production of circuit boards with large steps. However, due to the improper structural design and material selection of the insulating layer of the electromagnetic shielding film, it is difficult for the electromagnetic shielding film to take into account the resistance at the same time. The solderability and the bonding strength between the insulating layer and the metal layer lead to easy delamination of the electromagnetic shielding film, which in turn causes the metal layer of the electromagnetic shielding film to break and the shielding effectiveness to decrease

Method used

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preparation example Construction

[0028] The preparation process of the electromagnetic shielding film is not particularly limited in the present invention, it can be prepared according to the preparation process of the electromagnetic shielding film well known to those skilled in the art, and can be prepared according to the following process:

[0029] a), coating the first insulating layer material on one side of the carrier layer material, and curing to obtain the first insulating layer arranged on one side of the carrier layer; the carrier layer material is preferably a PET film; the first insulating layer The material includes polyimide resin, and preferably also includes heat-conducting material and / or light-absorbing material; the curing temperature is preferably 120-200°C; the curing time is preferably 30-120s.

[0030] b) coating a second insulating layer material on the surface of the first insulating layer and curing it to obtain a second insulating layer disposed on the surface of the first insulati...

Embodiment 1

[0038] 1) Raw materials:

[0039] PET film (number-average molecular weight 50,000-120,000, thickness 20 μm); polyimide resin (sp-f1 polyimide resin from DuPont, USA); boron nitride (particle size ≤ 3 μm); alumina (particle size diameter≤3μm); iron oxide black (particle size≤3μm); epoxy resin (number average molecular weight 10000-30000, viscosity at 21°C 3000-7000cps); copper powder (particle diameter 1-5μm); nickel powder (particle size 1-5μm); PET release film (single-sided silicone oil release film, number average molecular weight 50,000-120,000, thickness 20μm, release force 5-10gf).

[0040] 2) Electromagnetic shielding film specifications, as shown in Table 1:

[0041] The electromagnetic shielding film specification that table 1 embodiment 1 provides

[0042]

[0043] 3) Preparation of electromagnetic shielding film:

[0044] According to the design specifications of the above electromagnetic shielding film, the electromagnetic shielding film is prepared; first, ...

Embodiment 2

[0046] 1) Raw materials:

[0047] PET film (number-average molecular weight 50,000-120,000, thickness 100 μm); polyimide resin (sp-f1 polyimide resin from DuPont, USA); boron nitride (particle size ≤ 3 μm); alumina (particle size diameter≤3μm); iron oxide black (particle size≤3μm); epoxy resin (number average molecular weight 10000-30000, viscosity at 21°C 3000-7000cps); copper powder (particle diameter 1-5μm); nickel powder (particle size 1-5μm); PET release film (single-sided silicone oil release film, number average molecular weight 50,000-120,000, thickness 100μm, release force 5-10gf).

[0048] 2) Electromagnetic shielding film specifications, as shown in Table 2:

[0049] The electromagnetic shielding film specification that table 2 embodiment 2 provides

[0050]

[0051] 3) Preparation of electromagnetic shielding film:

[0052] According to the design specifications of the above electromagnetic shielding film, the electromagnetic shielding film is prepared; first...

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Abstract

The invention belongs to the field of shielding films, and particularly relates to an electromagnetic shielding film. The electromagnetic shielding film comprises a carrier layer, a first insulation layer, a second insulation layer, a metal layer, a conductive adhesive layer and a protective layer which are in contact sequentially. The first insulation layer comprises polyimide resin. The second insulation layer comprises first resin. The first resin comprises acrylic resin and / or epoxy resin. The electromagnetic shielding film is provided with the first insulation layer comprising polyimide resin and the second insulation layer comprising acrylic resin and / or epoxy resin, it is ensured that high adhesive force is achieved between the insulation layer and the metal layer, and the soldering resistance of the electromagnetic shielding film is remarkably improved. According to the preferential implementing mode, heat conduction materials are added in the insulation layers, and therefore the electromagnetic shielding film has the good cooling effect.

Description

technical field [0001] The invention belongs to the field of shielding films, in particular to an electromagnetic shielding film. Background technique [0002] In recent years, in order to prevent electronic equipment from malfunctioning due to the interference of electromagnetic waves received from the outside or the interference of electromagnetic waves received by internal electronic components, important electronic components and flexible circuit boards are often covered with electromagnetic shielding films. (referred to as FPC). [0003] Electromagnetic shielding film is usually composed of carrier layer, insulating layer, metal layer, conductive adhesive layer and protective layer. For example, in the Chinese patent application number 201220710157.X, a high-fill electromagnetic shielding film is disclosed, which includes a carrier film layer, an insulating layer, a foamed metal layer, a conductive adhesive layer and The protective film layer, wherein the material of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/082B32B15/095B32B15/092B32B27/18B32B27/08B32B27/06H05K9/00
CPCB32B15/082B32B15/092B32B15/095B32B27/06B32B27/08B32B27/18B32B2307/212B32B2307/714H05K9/0084
Inventor 胡银坤
Owner 胡银坤
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