Method for manufacturing heat-generating substrate for thermal print head
A technology of thermal print head and manufacturing method, which is applied in printing and other directions, can solve the problems of unmentioned photosensitive glue, etc., and achieve the effect of simple operation steps and low equipment cost
Active Publication Date: 2017-08-15
SHANDONG HUALING ELECTRONICS
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Although the electroplating method of using polymer fiber material to absorb Pd (chemical element palladium) is mentioned in the prior art, there is no mention of the method of using photosensitive adhesive to form a circuit
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[0025] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.
[0026] figure 1 A sectional view showing a glue application process and a glue exposure process of the heat-generating substrate for a thermal print head according to the present invention. Such as figure 1 As shown, the photosensitive adhesive 3 with a film thickness of 1 μm to 3 μm is coated on the surface of the insulating substrate 1 with equipment such as a roller coater, which is called a glue coating process. Wherein, the insulating substrate 1 can be made of ceramic material, transparent glass or polymer resin. When the insulating substrate 1 is made of a ceramic material, a smoothing layer 2 formed of a glass material may be provided on the ceramic substrate in order to alleviate the roughness of the surface of the ceramic substrate. Of course, when the insulating substrate 1 is made of a smooth material, the smooth layer 2 does ...
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The invention provides a manufacturing method of a heating substrate for a heat-sensitive printing head. The manufacturing method of the heating substrate for the heat-sensitive printing head comprises the following steps of coating light-sensitive glue on the surface of an insulating substrate; carrying out light radiation on the light-sensitive glue through a light mask, wherein the light mask is provided with a patterned light shielding film; soaking the light-sensitive glue through a first alkaline solution, and selectively dissolving the light-sensitive glue; soaking the insulating substrate in a colloidal solution at least containing Pd, making the Pd adhere to the surfaces of the insulating substrate and the light-sensitive glue, so as to form a Pd catalytic layer; soaking the insulating substrate in a second alkaline solution, so as to remove the light-sensitive glue and the Pd catalytic layer, which is adsorbed on the surface of the light-sensitive layer, together; forming a resistor layer, which comprises a plurality of heating part, through carrying out electroless plating on the surface of the Pd catalytic layer; and spreading the light-sensitive glue on the surfaces of the heating parts, plating electrodes on the two sides of the heating parts in a main scanning direction by utilizing an electroless plating solution, and afterwards, removing the light-sensitive glue on the surfaces of the heating parts by utilizing an alkaline solution. The above manufacturing method is simple in operating steps; and the cost of used equipment is low.
Description
technical field [0001] The invention relates to a thermal print head, in particular to a method for manufacturing a heating substrate for a thermal print head used in a facsimile machine and a printer. Background technique [0002] The heat-generating substrate used in the thermal print head in the prior art can be manufactured by the electroplating method of the cation treatment process, the colloid solution catalyst treatment process and the accelerated electrode process. Although the electroplating method of using polymer fiber material to absorb Pd (chemical element palladium) is mentioned in the prior art, there is no mention of the method of using photosensitive glue to form a circuit. Contents of the invention [0003] In order to solve the problems in the prior art, the present invention proposes a method of manufacturing a heat generating substrate for a thermal print head so that a heat generating portion can be formed using a simple process without expensive equ...
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IPC IPC(8): B41J2/335
CPCB41J2/33515
Inventor 王吉刚远藤孝文冷正超邓丽艳
Owner SHANDONG HUALING ELECTRONICS