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Cover tape heat-sealing process method

A process method and technology for cover tape, applied in the field of cover tape heat sealing process, can solve the problems of poor antistatic performance of cover tape and complicated production process, and achieve the effect of low requirements and simple production process

Inactive Publication Date: 2016-10-12
成都格虹电子科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Cover tape is an essential material for packaging in the electronics industry. Its production process is complicated and the antistatic performance of the existing cover tape is not good.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A heat-sealing process for a cover tape, comprising the steps of:

[0020] The production process of antistatic film;

[0021] The substrate layer is laminated on the adhesive layer;

[0022] Coating the wax layer on the antistatic film;

[0023] The antistatic layer coated with the wax layer is adhered to the substrate layer.

[0024] The manufacturing process of the antistatic layer includes setting a bubble layer in the film, pouring an antistatic agent into the bubble layer and sealing the bubble layer.

[0025] The components by weight of the antistatic agent are: 20 parts of glycerin, 20 to 25 parts of ethoxylated alkylamine, 10 parts of surfactant, 30 parts of polyethylene glycol glycidyl ether, and the rest is water.

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PUM

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Abstract

The invention discloses a cover tape heat-sealing process method, which comprises the following steps of manufacturing an anti-static film; laminating a base material layer on a bonding layer; coating a wax layer on the anti-static film; bonding the anti-static film coated with the wax layer on the base material layer. The manufacturing process is simple, and the anti-static performance of a cover tape is good.

Description

[0001] technical field [0002] The invention relates to the field of heat-sealing process methods, in particular to a cover tape heat-sealing process method. Background technique [0003] Along with the miniaturization of electronic equipment, electronic components used are also becoming smaller and more high-performance, and electronic components are automatically mounted on printed circuit boards in the assembly process of electronic equipment. The above-mentioned electronic components for chip-type surface mounting are accommodated on a carrier tape on which storage pockets thermoformed according to the shape of the electronic components are continuously formed. After storing electronic components in each storage bag, a cover tape as a covering material is stacked on top of the carrier tape. [0004] Cover tape is an essential material for packaging in the electronics industry. Its production process is complicated and the antistatic performance of the existing cover ta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B15/04
CPCB65B15/04
Inventor 周长贵王斌何保居
Owner 成都格虹电子科技有限责任公司
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