Ultraviolet light emitting diode packaging structure and manufacturing method therefor

A technology for light-emitting diodes and packaging structures, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of substrate and glass bonding, thermal expansion coefficient mismatch, etc., to solve thermal expansion coefficient mismatch, improve reliability, The effect of prolonging the service life

Active Publication Date: 2016-10-12
XIAMEN SANAN OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to improve the service life of low-band UVLEDs, some manufacturers have used glass and other inorganic materials instead of organic packaging silica gel, but the bonding between the substrate and the glass has become a problem
However

Method used

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  • Ultraviolet light emitting diode packaging structure and manufacturing method therefor
  • Ultraviolet light emitting diode packaging structure and manufacturing method therefor
  • Ultraviolet light emitting diode packaging structure and manufacturing method therefor

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0035] Example 1

[0036] Such as Figure 1~3 As shown, this embodiment provides an ultraviolet light emitting diode packaging structure, including: a bracket 100, a flip-chip LED chip 200, and a package cover 300. A circuit is formed on the bracket 100, and the LED chip 200 is fixed on the bracket 100 and connected to the bracket. The circuit of the encapsulation cover 300 is electrically connected, an annular groove structure 301 is provided on the outer periphery of the lower surface of the package cover 300, a reflective layer 303 is provided on the inner surface of the groove structure, and the groove structure 301 is filled with an organic adhesive 302; The cover 300 is disposed on the LED chip 200 and is connected to the support 100 through an organic adhesive 302.

[0037] The material of the bracket 100 can be a ceramic bracket or a plastic bracket, and the ceramic bracket is preferred in this embodiment. The shape of the support preferably has a bowl 101, the bowl 101 ...

Example Embodiment

[0047] Example 2

[0048] Such as Figure 4 with 5 As shown, the difference between this embodiment and Embodiment 1 is that the package cover 300 of Embodiment 1 adopts a quartz lens, while the package cover 300 of this embodiment adopts a glass cover; the groove structure 301 of Embodiment 1 has a circular ring shape. The groove structure 301 of this embodiment is square and located at the outer edge of the glass cover. The design advantage of this structure is that since the position where the groove structure is opened is far away from the ultraviolet LED light source to the greatest extent, it can further avoid possible aging of the organic adhesive caused by UV irradiation and affect the reliability of the device.

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PUM

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Abstract

The invention discloses an ultraviolet light emitting diode packaging structure and a manufacturing method therefor. The ultraviolet light emitting diode packaging structure comprises a bracket, an LED chip and a packaging cover body, wherein a circuit is formed on the bracket; the LED chip is fixed on the bracket and electrically connected with the circuit on the bracket; the packaging structure is characterized in that a groove structure is arranged on the periphery of the lower surface of the packaging cover body; the groove structure is filled with an organic adhesive glue; and the packaging cover body is arranged above the LED chip and connected with the bracket through the organic adhesive glue.

Description

technical field [0001] The invention relates to an LED packaging technology, in particular to an ultraviolet light emitting diode (LED) device packaging structure and a manufacturing method thereof. Background technique [0002] A light-emitting diode (LED for short) is a solid semiconductor light-emitting device. With the development of LED technology, the packaging band of LED is gradually developing towards near ultraviolet or even deep ultraviolet, and the power is also developing towards high power. However, with traditional packaging, a layer of organic encapsulant with a high refractive index is usually coated on the surface of the LED chip, and this type of organic encapsulant is prone to failure due to factors such as water, light, and heat under long-term service conditions. It leads to a sharp attenuation of the luminous flux and radiation flux of the device, and even causes the device to fail. For high-power LED integrated light sources, due to various reasons,...

Claims

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Application Information

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IPC IPC(8): H01L33/48
CPCH01L33/48H01L2933/0033H01L2924/16195H01L33/44H01L33/486H01L33/58H01L33/62H01L33/60H01L2933/0058H01L33/483
Inventor 时军朋林秋霞林振端徐宸科赵志伟
Owner XIAMEN SANAN OPTOELECTRONICS TECH CO LTD
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