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Ultraviolet light emitting diode packaging structure and manufacturing method therefor

A technology for light-emitting diodes and packaging structures, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of substrate and glass bonding, thermal expansion coefficient mismatch, etc., to solve thermal expansion coefficient mismatch, improve reliability, The effect of prolonging the service life

Active Publication Date: 2016-10-12
XIAMEN SANAN OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to improve the service life of low-band UVLEDs, some manufacturers have used glass and other inorganic materials instead of organic packaging silica gel, but the bonding between the substrate and the glass has become a problem
However, the use of packaging forms such as AuSn eutectic requires metal plating on the glass and the substrate, so a new machine and process are required, and there is a risk of mismatching the coefficient of thermal expansion (CTE) in this contact.

Method used

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  • Ultraviolet light emitting diode packaging structure and manufacturing method therefor
  • Ultraviolet light emitting diode packaging structure and manufacturing method therefor
  • Ultraviolet light emitting diode packaging structure and manufacturing method therefor

Examples

Experimental program
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Effect test

Embodiment 1

[0036] Such as Figure 1~3 As shown, the present embodiment provides a packaging structure for ultraviolet light emitting diodes, including: a bracket 100, a flip-chip LED chip 200 and a package cover 300, a circuit is formed on the bracket 100, and the LED chip 200 is fixed on the bracket 100 and connected to the bracket. The circuit is electrically connected, the lower surface of the encapsulation cover 300 is provided with a circular groove structure 301, the inner surface of the groove structure is provided with a reflective layer 303, and an organic adhesive 302 is filled in the groove structure 301; The cover body 300 is disposed on the LED chip 200 and connected to the bracket 100 through an organic adhesive 302 .

[0037] The material of the bracket 100 can be a ceramic bracket or a plastic bracket, and the ceramic bracket is preferred in this embodiment. The shape of the bracket preferably has a bowl cup 101 surrounding the LED chip 200 , the groove structure 301 is ...

Embodiment 2

[0048] Such as Figure 4 and 5 As shown, the difference between this embodiment and Embodiment 1 is that: the packaging cover 300 of Embodiment 1 adopts a quartz lens, while the packaging cover 300 of this embodiment adopts a glass cover plate; the groove structure 301 of Embodiment 1 is circular , the groove structure 301 of this embodiment is square and located on the outer edge of the glass cover. The design advantage of this structure is that since the position of the groove structure is far away from the ultraviolet LED light source to the greatest extent, it can further avoid the possible aging of the organic adhesive caused by UV radiation and affect the reliability of the device.

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Abstract

The invention discloses an ultraviolet light emitting diode packaging structure and a manufacturing method therefor. The ultraviolet light emitting diode packaging structure comprises a bracket, an LED chip and a packaging cover body, wherein a circuit is formed on the bracket; the LED chip is fixed on the bracket and electrically connected with the circuit on the bracket; the packaging structure is characterized in that a groove structure is arranged on the periphery of the lower surface of the packaging cover body; the groove structure is filled with an organic adhesive glue; and the packaging cover body is arranged above the LED chip and connected with the bracket through the organic adhesive glue.

Description

technical field [0001] The invention relates to an LED packaging technology, in particular to an ultraviolet light emitting diode (LED) device packaging structure and a manufacturing method thereof. Background technique [0002] A light-emitting diode (LED for short) is a solid semiconductor light-emitting device. With the development of LED technology, the packaging band of LED is gradually developing towards near ultraviolet or even deep ultraviolet, and the power is also developing towards high power. However, with traditional packaging, a layer of organic encapsulant with a high refractive index is usually coated on the surface of the LED chip, and this type of organic encapsulant is prone to failure due to factors such as water, light, and heat under long-term service conditions. It leads to a sharp attenuation of the luminous flux and radiation flux of the device, and even causes the device to fail. For high-power LED integrated light sources, due to various reasons,...

Claims

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Application Information

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IPC IPC(8): H01L33/48
CPCH01L33/48H01L2933/0033H01L2924/16195H01L33/44H01L33/486H01L33/58H01L33/62H01L33/60H01L2933/0058H01L33/483
Inventor 时军朋林秋霞林振端徐宸科赵志伟
Owner XIAMEN SANAN OPTOELECTRONICS TECH CO LTD
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