Epoxy resin water-permeable material curing agent and preparation method and application thereof

Abstract

The invention belongs to the technical field of preparation of curing agents, and discloses an epoxy resin water-permeable material curing agent and a preparation method and application thereof. The curing agent is prepared from the following components in percentage by mass: 50-80 percent of ricinoleic acid and/or a polymer thereof, and 20-50 percent of fatty polyamine, alicyclic polyamine or polyoxypropylene polyamine containing a polypropylene oxide chain segment. The curing agent provided by the invention is a waterborne curing agent, has superior curing performance, and can be cured at the room temperature; a cured product has superior water permeability and air permeability, and can be applied to curing of an epoxy water-permeable material to prepare an epoxy ceramic forming mold or an epoxy water-permeable material. A fatty polyamine, polyoxypropylene polyamine or alicyclic polyamine curing agent is modified, so that the curing agent contains hydrophobic long-chain alkyl, hydrophilic hydroxyl, an amino group, acylamino and an ester group, has self-emulsifying performance, and can also be taken as a curing agent; a gap and a channel are formed between the epoxy resin and inorganic filler through a hydrophobic group, so that the obtained epoxy material has superior water permeability and air permeability.

Description

technical field [0001] The invention belongs to the technical field of curing agent preparation, and in particular relates to a curing agent for epoxy resin water-permeable material and its preparation method and application. Background technique [0002] With the development of mechanization and automation in the ceramic industry, traditional gypsum as a mold material for ceramic molding can no longer meet the requirements of modern production due to its low strength and low water absorption. Plastic molds have gradually become the mainstream of mold materials for ceramic molding in the future. [0003] Epoxy resin is a common thermosetting resin with excellent properties such as bonding properties, adhesion properties, thermal stability, mechanical properties, chemical corrosion resistance, electrical insulation properties, high mechanical strength, widely used in coatings, adhesives , electronic and electrical insulation materials, composite materials and other fields. ...

AI Technical Summary

Problems solved by technology

However, although the existing epoxy resin water-based curing agent has a certain self-emulsification and curing effect, its molecular structure, molecular weight, HLB and other reasons, in the process of mixing and curing with epoxy resin and water-phase inorganic filler system , can not make the epoxy resin-curing agent-water-containing inorganic filler multi-phase system exist stably for a long time, more or less phase separation occurs, so that the cured material and water phase will produce defects, shrinkage or uneven distribution of pores and closed Pore ​​phenomenon, epoxy resin through-hole type water-permeable material with excellent water-permeable performance cannot be obtained

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