Method for implementing surface mounting on PCB yoke plate by using fixture

Abstract

The invention provides a method for implementing surface mounting on a PCB yoke plate by using a fixture. A PCB SMT fixture is used for implementing surface mounting on the PCB yoke plate, the PCB SMT fixture is an aluminum alloy SMT fixture which performs cutting with different thicknesses on different parts and is provided with fixing pins at different positions, and the PCB SMT fixture is provided with a transmission band carrying area, a PCB yoke plate mounting area, a first front face milling area, a second front face milling area, a back face milling area and the plurality of fixing pins. According to the method, the specially designed PCB SMT fixture is adopted, so that waste during a production process of the PCB yoke plate can be reduced, the screen printing quality can be improved, the first pass yield of products can be increased, and simultaneous surface mounting on two surfaces of the PCB yoke plate by one production line can be achieved, the production efficiency can be greatly improved, and the production cost can be greatly reduced.

Description

technical field [0001] The invention relates to the technical field of surface mounting, in particular to a method for surface mounting of PCB joint boards by using a fixture. Background technique [0002] At present, the appearance of mobile phones is becoming thinner and thinner, and the functions are more and more powerful. Therefore, there will be high-density component layouts on both sides of the mobile phone circuit board. A frame is designed on the periphery, which is mainly for the positioning and transmission bearing needs on the production line. This kind of PCB board with frame needs to mount components on both sides of the PCB, so it is necessary to arrange a production line to screen print, patch, and flow solder the first side (A side, front side) on the board. After the production of side A is completed, another production line will be arranged to screen print, patch and flow solder the second side (side B, reverse side). [0003] This traditional surface m...

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Problems solved by technology

[0003] This traditional surface mount technology has the following main shortcomings: 1. Since the PCB board needs to be transmitted through the transmission belt during the production process, and the mobile phone circuit board is full of components, it cannot be used as the bearing part of the transmission belt. A part of the frame must be expanded to serve as the bearing part of the transmission belt, thereby increasing the area of ​​the PCB board, resulting in waste of the PCB board and an increase in cost; 2. Nowadays, the design of circuit boards is getting thinner and lighter, and the density of components is getting higher , the pin spacing of devices is getting smaller and smaller, and it is becoming more and more difficult to control good solder paste screen printing quality; 3. The mobile phone printed circuit board will be deformed to a certain extent under the high temperature conditions of reflow soldering. Deformation will especially cause faults such as short-circuit and short-circuit welding of fine-pitch components; 4. For the mode in which the PCB board directly flows into the production line, the screen printing equipment of the production line and the programming of the placement equipment can only be targeted at one side at the same time. It is impossible to carry out simultaneous production on A and B sides, so two lines must be arranged at the same time, which leads to low production efficiency and increased production costs

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