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Resin composition for display substrate, resin thin film for display substrate, and method for producing resin thin film for display substrate

A technology of resin composition and resin film, which is applied in the direction of instruments, coatings, optics, etc., can solve the problems of damage to film strength, flexibility, etc., and achieve the effects of light weight, raw material cost, and high heat resistance

Active Publication Date: 2016-10-26
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] As a polyimide exhibiting low linear expansion, a polyimide formed of an acid dianhydride and a diamine having high rigidity has been proposed, but it has many problems, for example, around the glass transition temperature of the polymer The high temperature range (300-500°C) becomes high linear expansion; when the rigidity of the polymer skeleton is too high, the strength and flexibility of the film will be damaged; etc. (patent document 1, non-patent document 1), fully satisfying the high The requested polyimide is not yet known

Method used

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  • Resin composition for display substrate, resin thin film for display substrate, and method for producing resin thin film for display substrate
  • Resin composition for display substrate, resin thin film for display substrate, and method for producing resin thin film for display substrate
  • Resin composition for display substrate, resin thin film for display substrate, and method for producing resin thin film for display substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0144]

[0145] BPDA(98) / / p-PDA(90) / DATP(5) / APAB(5)

[0146] 17.8g (0.165 moles) of p-PDA and 2.38g (0.009 moles) of DATP, and 2.05g (0.009 moles) of APABI were dissolved in 420g of NMP, while adding 52.8g (0.179 moles) of BPDA, and then adding 5g of NMP, under a nitrogen atmosphere, reacted at 23°C for 24 hours.

[0147] The weight average molecular weight (Mw) of the obtained polymer was 63800, and the molecular weight distribution (Mw / Mn) was 11.3. This solution was used as the resin composition for display substrates.

Embodiment 2

[0148]

[0149] BPDA(98) / / p-PDA(70) / DATP(25) / APAB(5)

[0150] 12.9g (0.119 moles) of p-PDA and 11.1g (0.043 moles) of DATP, and 1.90g (0.009 moles) of APABI were dissolved in 420g of NMP, while adding 49.1g (0.167 moles) of BPDA, and then adding 5g of NMP, under a nitrogen atmosphere, reacted at 23°C for 24 hours.

[0151] The Mw of the obtained polymer was 65500, and the molecular weight distribution (Mw / Mn) was 12.8. This solution was used as the resin composition for display substrates.

Embodiment 3

[0152]

[0153] BPDA(98) / / p-PDA(70) / DATP(30)

[0154] 12.8g (0.119 mole) p-PDA and 13.2g (0.051 mole) DATP are dissolved in the NMP of 420g, add 48.9g (0.167 mole) BPDA at the same time, then, add the NMP of 5g again, under nitrogen atmosphere, at 23 °C for 24 hours.

[0155] The Mw of the obtained polymer was 66300, and the molecular weight distribution (Mw / Mn) was 12.9. This solution was used as the resin composition for display substrates.

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Abstract

The present invention provides a resin composition for a display substrate, with which it is possible to form a resin thin film for a display substrate that has a high heat resistance, an appropriate coefficient of linear expansion, and a high tensile strength. The resin composition for a display substrate contains a polyamic acid comprising structural units represented by formula (I) and having a weight-average molecular weight of 10,000 or more, and an organic solvent. In formula (1), X1 represents a tetravalent aromatic group of formula (3), Y1 represents a group represented by formula (P), and n represents a number of repeating units.

Description

technical field [0001] The present invention relates to a resin composition for a display substrate, a resin film for a display substrate, and a method for producing a resin film for a display substrate. Background technique [0002] In recent years, in the field of display devices such as organic electroluminescent displays and liquid crystal displays, there has been an increasing demand for weight reduction, flexibility, and the like in addition to high resolution. In view of this, polyimide resin, which is easy to manufacture and is known to have high heat resistance, has attracted attention as a substrate material for a display instead of glass. [0003] However, in order to use polyimide as a display substrate material, its linear expansion coefficient needs to be a value close to that of glass (about 3-10ppm / K), but most polyimides have a value of 60-10ppm / K. The coefficient of linear expansion is about 80ppm / K, so it is not suitable for the substrate material of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08L79/08G02F1/1333G09F9/30
CPCC08G73/1042C08G73/1067C08G73/1071C08G73/14C08G73/18C09D179/08G02F1/133305
Inventor 江原和也
Owner NISSAN CHEM IND LTD