Shielding structures for system-in-package assemblies in portable electronic devices

A technology for electronic equipment and packaging components, which is applied in the field of interference mitigation and can solve problems such as limiting shielding effect and limiting equipment size.

Active Publication Date: 2016-10-26
APPLE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, shielding cans and conductive paste can limit shielding effectiveness and may limit device size

Method used

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  • Shielding structures for system-in-package assemblies in portable electronic devices
  • Shielding structures for system-in-package assemblies in portable electronic devices
  • Shielding structures for system-in-package assemblies in portable electronic devices

Examples

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Embodiment Construction

[0017] In the following description of examples, reference is made to the accompanying drawings, in which specific examples that may be practiced are shown by way of illustration. It is to be understood that other examples may be utilized and structural changes may be made without departing from the scope of the various examples.

[0018] The present disclosure relates to shielding structures for electrical, mechanical and optical components and subsystems in portable electronic devices assembled using system-in-package (SiP) technology. The shielding structure may include, but is not limited to, a radio frequency shielding structure and / or a magnetic shielding structure. The shielding structure may shield components such as integrated circuits (eg, transceiver integrated circuits, memory circuits, and other circuits) that operate in radio frequency bands. Components may also include circuits formed from one or more discrete components such as inductors, capacitors, resistors...

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PUM

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Abstract

A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate (614) and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer (616) over the components, forming narrow trenches (632) between subsystems, and conformally coating the insulating layer and trenches with a metal shielding layer (640). In some examples, trenches between subsystems can be formed using a laser source. In some examples, trenches between subsystems can have angled walls. In some examples, the metal shielding layer can be formed using at least one of electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition.

Description

technical field [0001] The present disclosure relates generally to interference mitigation, and more particularly to electromagnetic shielding structures that help isolate components in a system-in-package assembly from interference in a compact portable electronic device. Background technique [0002] Compact portable electronic devices are becoming more and more popular. Examples of compact portable electronic devices include laptop computers, tablet computing devices, cellular phones, media players, gaming devices, handheld devices, miniature devices such as pendant devices and wearable devices, and other devices. It is often desirable to reduce the size of compact portable electronic devices; however, such devices often include circuitry that requires electromagnetic shielding. For example, some electronic devices include radio frequency transceiver circuits that are susceptible to radio frequency interference. Electronic devices may also include memory and other compo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28H05K1/02
CPCH05K1/0218H05K3/284H05K1/0215H05K9/0039H05K2201/0723H05K2201/09972H05K2201/1056H05K2201/0715H01L2924/1815H01L2924/3025H05K9/0024
Inventor 陈延锋S·S·潘纳瑟尔
Owner APPLE INC
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