Diamond abrasive arrangement system

Abstract

The invention relates to a diamond grinding material arranging system, and belongs to the technical field of grinding tool manufacturing. The diamond grinding material arranging system comprises a material taking device and a worktable, wherein the material taking device comprises a cavity; the upper part of the cavity is connected with a vacuum device through an extraction opening; an arranging template component is fixedly mounted at the lower part of the cavity; the arranging template component comprises a ferromagnetic arranging pore plate, a high-elasticity plate and a mounting plate; the edge of the arranging pore plate is adhered onto the high-elasticity plate; the high-elasticity plate is mounted on the mounting plate; and a plurality of pores which are used for adsorbing and fixing diamond grinding materials are formed in the ferromagnetic arranging pore plate. The diamond grinding material arranging plate is provided with the ferromagnetic arranging pore plate, so that a vibrator can be saved and the arranging precision is remarkably improved.

Description

technical field [0001] The invention relates to the technical field of grinding tool manufacturing, more specifically, the invention relates to a diamond abrasive arrangement system. Background technique [0002] Materials such as granite, marble, concrete, asphalt are typical examples of cutting with diamond saw blades. The diamond saw blade has a cutting layer of diamond abrasive on the periphery of the saw blade substrate. Saw blades usually consist of diamond particles and a metal matrix that holds the diamond. At present, the production process commonly used in diamond saw blades: add a certain concentration of diamond to metal binders (such as iron powder, copper powder, tin powder, nickel powder, cobalt powder, etc.), and use mechanical mixing to combine Diamonds are mixed with a metal bond, loaded into molds for billeting and sintering. The process has the following problems: (1) Mechanical mixing cannot ensure that the diamond abrasive is evenly distributed in th...

AI Technical Summary

Problems solved by technology

The process has the following problems: (1) Mechanical mixing cannot ensure that the diamond abrasive is evenly distributed in the metal bond, resulting in a high concentration of diamond abrasive in some areas, too low in some areas, and no diamond abrasive in some areas; Uneven distribution, the cutting efficiency of the saw blade decreases, the cutting resistance is high in areas with high diamond abrasive concentration, the chips are easy to clog, and the cutting efficiency is low

The production efficiency of this process is low, one glue drop is easy to adhere to different abrasives, and the arrangement accuracy is poor

The patent technology CN101786263B proposed by the applicant of the present application discloses a diamond abrasive orderly arrangement system, which is provided with an arrangement orifice, and uses vacuum adsorption and desorption, and vibration to arrange diamond abrasives, although vibration will help the diamond Abrasives are detached from the arrangement orifice to reduce leakage, but at the same time reduce the arrangement accuracy

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