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Preparation process of organic silicon material for LED packaging with high adhesion

A technology of LED packaging and high adhesion, applied in the direction of non-polymer adhesive additives, adhesives, adhesive additives, etc., can solve the problems of restricting the development of LED industry and high price, and achieve good optical and mechanical properties , good adhesion and high tensile strength

Pending Publication Date: 2016-11-02
西安烨森电子科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the limitation of technical level, the organosilicon materials used in domestic LED packaging are mainly imported, and the price is expensive, which seriously restricts the development of the LED industry.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] The preparation process of organic silicon materials for high-adhesion LED packaging is completed through the following steps:

[0014] (1) 25 parts of ethyl orthosilicate, 35 parts of vinyl phenyl silicone resin, 15 parts of vinyl polysiloxane, 13 parts of tetramethyl divinyl disiloxane, treated with silane coupling agent Add 3 parts of nano silicon dioxide into the internal mixer, and banbury for 1 hour;

[0015] (2) Add 2 parts of platinum complex in a nitrogen atmosphere, and then banbury for 10 minutes;

[0016] (3) Add 1 part of retarder acetylenic alcohol compound and continue banburying for 10 minutes;

[0017] (4) vacuum degassing at room temperature for 15 minutes to the material after banburying;

[0018] (5) Vulcanize and mold the defoamed material at a temperature of 50 degrees to obtain a highly cohesive organic silicon material for LED packaging.

Embodiment 2

[0020] The preparation process of organic silicon materials for high-adhesion LED packaging is completed through the following steps:

[0021] (1) 30 parts of ethyl orthosilicate, 38 parts of vinyl phenyl silicone resin, 20 parts of vinyl polysiloxane, 18 parts of tetramethyl divinyl disiloxane, treated with silane coupling agent Add 5 parts of nano silicon dioxide into the internal mixer, and banbury for 2 hours;

[0022] (2) Add 3 parts of platinum complex in a nitrogen atmosphere, and then banbury for 15 minutes;

[0023] (3) Add 3 parts of retarder acetylenic alcohol compound, continue banburying for 15 minutes;

[0024] (4) vacuum degassing at room temperature for 20 minutes to the material after banburying;

[0025] (5) Vulcanize and mold the defoamed material at a temperature of 150 degrees to obtain a highly cohesive organic silicon material for LED packaging.

[0026] After inspection, the organic silicon materials for LED packaging prepared in Examples 1 and 2 of ...

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Abstract

The invention discloses a preparation process of an organic silicon material for high-adhesion LED packaging. The method comprises the following steps: (1) preparing tetraethyl orthosilicate, vinyl phenyl silicone resin, vinyl polysiloxane, Methyldivinyldisiloxane and nano-silica treated with silane coupling agent are added to the internal mixer, and banburying for 1-2 hours; (2) adding platinum complex in a nitrogen atmosphere, and then banburying for 10 -15 minutes; (3) add retarder acetylenic alcohol compound, continue banburying for 10-15 minutes; (4) vacuum defoaming at room temperature for 15-20 minutes to the material after banburying; (5) at 50-150 degree temperature Next, vulcanize and mold the defoamed material to obtain a high-adhesive silicone material for LED packaging. The organosilicon material of the invention has good optical properties and mechanical properties, high tensile strength and good adhesive force.

Description

technical field [0001] The invention relates to organosilicon materials, in particular to a preparation process of organosilicon materials for high-adhesive LED packaging. Background technique [0002] At present, the energy consumed by human beings in the lighting field is very huge, and the development of new lighting appliances with more energy-saving effects is of great significance to the world. LED technology is currently one of the most promising high-tech fields, among which white LEDs have been widely used in lighting, car lights, LCD computer backlight sources, mobile phones and TVs, etc. LED lights have a series of advantages such as low energy consumption, long life, and no pollution. They are very beneficial to meet human needs in energy conservation and environmental protection and to alleviate energy and environmental crises. Encapsulation materials are very important for LED lights, because the quality of encapsulation materials will affect the reliability a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J11/04C09J11/06H01L33/56
Inventor 李庆方
Owner 西安烨森电子科技有限责任公司
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