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Non-contact glue spraying system and method in the production of surface mount quartz crystal resonators

A non-contact, quartz crystal technology, applied in impedance networks, electrical components, etc., can solve problems such as poor dispensing, and achieve the effects of easy operation, improved gluing efficiency, and simple production process operations.

Active Publication Date: 2018-10-02
SICHUAN MDH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] In view of the deficiencies in the prior art, the non-contact glue spraying system and method in the production of surface mount quartz crystal resonators provided by the present invention solve the problem of poor glue dispensing on the entire board of the base by traditional contact dispensing. Mobile glue spraying, no need to adjust the dispensing height, to ensure that the conductive glue with the same diameter and qualified appearance is coated on the left and right dispensing platforms of each base to fix the wafer and base, and the glue spraying efficiency is higher than that of dispensing

Method used

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  • Non-contact glue spraying system and method in the production of surface mount quartz crystal resonators
  • Non-contact glue spraying system and method in the production of surface mount quartz crystal resonators
  • Non-contact glue spraying system and method in the production of surface mount quartz crystal resonators

Examples

Experimental program
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Effect test

Embodiment 1

[0071] In this embodiment, select the single base located in the first row and the first column on the entire base board to complete the process of spraying glue, putting on the film, and spraying glue, and then apply all remaining parts on the entire base board. The single base completes the same process, and finally the entire base completes the glue spraying process.

[0072] Before the entire glue spraying process is carried out, the following preparation steps are carried out:

[0073] Step 1. Place the whole base board without glue spraying in the base whole board cage and wait for extraction;

[0074] Step 2, the wafer is placed in the wafer cage and waits for extraction;

[0075] Step 3. Inject the stirred silver glue into the glue spray valve, and confirm whether the glue spray valve can spit glue normally;

[0076] Step 4. Adjust the height of the chip according to the position of the chip, and adjust the glue spraying time and glue spraying position according to t...

Embodiment 2

[0092] The spraying process of this embodiment is similar to that of Example 1, and the work to be done in the preparation stage, as well as the glue spraying position of the glue spraying valve and the glue spraying process are all consistent with Embodiment 1, only differing in the spraying sequence.

[0093] In this embodiment, step S1 is used to spray glue on each single base on the entire base board, and then step S2 is applied to each single base, and finally each single base Carry out step S3 to spray glue, specifically:

[0094] S1. Complete the spraying of glue on each single base on the entire base board in sequence according to the steps of spraying glue:

[0095] Move the whole base board to the injection valve to spray glue, and the conductive glue is sprayed on the left and right platforms of each single base in the whole base board according to the glue spraying method;

[0096] S2. Complete the loading of each single base on the entire base board in sequence: ...

Embodiment 3

[0107] The spraying process of this embodiment is similar to that of Example 1, and the work to be done in the preparation stage, as well as the glue spraying position of the glue spraying valve and the glue spraying process are all consistent with Embodiment 1, only differing in the spraying sequence.

[0108] In this embodiment, a plurality of single bases on the entire base board are selected, and these multiple single bases can be divided into regions on the entire base board, and can also be distributed scatteredly on the entire base board, but For the control of the utilization of the area, it is explained in the way of area division.

[0109] For the multiple monomer bases in the currently selected area on the entire base board, first perform step S1 to spray the glue, then perform step S2 for the multiple monomer bases in the currently selected area, and finally perform the step S2 on the currently selected area. Multiple monomer bases in the area are sprayed with glue...

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Abstract

A contactless adhesive spray system utilized in producing a surface-mount quartz crystal oscillator comprises a full array of substrate bases (1), chips (4), and an adhesive spray system. The full array of substrate bases (1) and the chips (4) adhered thereon are both located below a nozzle (7) of the adhesive spray system. Also provided a contactless adhesive spray method of producing a surface-mount quartz crystal oscillator. The method comprises: forming, on the full array of substrate bases (1), a plurality of single substrate bases (1-1); and spraying, on left platforms (2) and right platforms (3) of the single substrate bases (1-1), and auxiliary electrodes of chips adhered on the single substrate bases (1-1), and using a contactless method, an adhesive. The embodiment does not require a z-axis movement necessary in a conventional adhesive dispensing needle technique. The adhesive spray efficiency in the invention is increased by 3 or more times than that in the prior art.

Description

technical field [0001] The invention belongs to the field of electronic components, in particular to a non-contact glue spraying system and method in the production of surface-mounted quartz crystal resonators. Background technique [0002] Quartz crystal resonator, also known as quartz crystal, commonly known as crystal oscillator, is a resonator made by using the piezoelectric effect of quartz crystal. It can be used together with semiconductor devices and resistance-capacitance components to form a quartz crystal oscillator. [0003] Quartz wafer, hereinafter referred to as wafer, it can be square, rectangular or circular, etc., coated with silver layer on its two corresponding surfaces as electrodes, surface-mounted quartz crystal resonator is the electrode on the quartz wafer through conductive glue It is electrically connected with the base, and the quartz wafer is fixed on the base through conductive glue, and the secondary electrode on the quartz wafer is also coated...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H3/02H03H9/05H03H9/19
CPCH03H3/02H03H9/0538H03H9/19
Inventor 黄屹李斌
Owner SICHUAN MDH TECH CO LTD