Non-contact glue spraying system and method in the production of surface mount quartz crystal resonators
A non-contact, quartz crystal technology, applied in impedance networks, electrical components, etc., can solve problems such as poor dispensing, and achieve the effects of easy operation, improved gluing efficiency, and simple production process operations.
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Embodiment 1
[0071] In this embodiment, select the single base located in the first row and the first column on the entire base board to complete the process of spraying glue, putting on the film, and spraying glue, and then apply all remaining parts on the entire base board. The single base completes the same process, and finally the entire base completes the glue spraying process.
[0072] Before the entire glue spraying process is carried out, the following preparation steps are carried out:
[0073] Step 1. Place the whole base board without glue spraying in the base whole board cage and wait for extraction;
[0074] Step 2, the wafer is placed in the wafer cage and waits for extraction;
[0075] Step 3. Inject the stirred silver glue into the glue spray valve, and confirm whether the glue spray valve can spit glue normally;
[0076] Step 4. Adjust the height of the chip according to the position of the chip, and adjust the glue spraying time and glue spraying position according to t...
Embodiment 2
[0092] The spraying process of this embodiment is similar to that of Example 1, and the work to be done in the preparation stage, as well as the glue spraying position of the glue spraying valve and the glue spraying process are all consistent with Embodiment 1, only differing in the spraying sequence.
[0093] In this embodiment, step S1 is used to spray glue on each single base on the entire base board, and then step S2 is applied to each single base, and finally each single base Carry out step S3 to spray glue, specifically:
[0094] S1. Complete the spraying of glue on each single base on the entire base board in sequence according to the steps of spraying glue:
[0095] Move the whole base board to the injection valve to spray glue, and the conductive glue is sprayed on the left and right platforms of each single base in the whole base board according to the glue spraying method;
[0096] S2. Complete the loading of each single base on the entire base board in sequence: ...
Embodiment 3
[0107] The spraying process of this embodiment is similar to that of Example 1, and the work to be done in the preparation stage, as well as the glue spraying position of the glue spraying valve and the glue spraying process are all consistent with Embodiment 1, only differing in the spraying sequence.
[0108] In this embodiment, a plurality of single bases on the entire base board are selected, and these multiple single bases can be divided into regions on the entire base board, and can also be distributed scatteredly on the entire base board, but For the control of the utilization of the area, it is explained in the way of area division.
[0109] For the multiple monomer bases in the currently selected area on the entire base board, first perform step S1 to spray the glue, then perform step S2 for the multiple monomer bases in the currently selected area, and finally perform the step S2 on the currently selected area. Multiple monomer bases in the area are sprayed with glue...
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