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Method for manufacturing actinic light sensitive or radiation sensitive resin compostion, and actinic light sensitive or radiation sensitive resin compostion

A technology of actinic radiation and resin composition, which is applied in the field of actinic radiation or radiation sensitive resin composition, can solve the problems of insufficient improvement of storage stability, and achieve particle precipitation suppression, less particle amount, and stable excellent effect

Inactive Publication Date: 2016-11-09
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of forming an ultrafine pattern with a line width of 50 nm or less, the storage stability has not been sufficiently improved even by the method described above.

Method used

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  • Method for manufacturing actinic light sensitive or radiation sensitive resin compostion, and actinic light sensitive or radiation sensitive resin compostion
  • Method for manufacturing actinic light sensitive or radiation sensitive resin compostion, and actinic light sensitive or radiation sensitive resin compostion
  • Method for manufacturing actinic light sensitive or radiation sensitive resin compostion, and actinic light sensitive or radiation sensitive resin compostion

Examples

Experimental program
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Effect test

Embodiment

[0357] The present invention will be described in more detail through examples below, but the content of the present invention is not limited thereto.

[0358]

Synthetic example 1

[0359] Synthesis Example 1: Synthesis of P-1

[0360]Under nitrogen flow, 40 g of a mixed solvent of 6 / 4 (mass ratio) of propylene glycol monomethyl ether acetate and propylene glycol monomethyl ether was added to a three-necked flask, and it was heated to 80° C. (solvent 1). The monomers corresponding to the following repeating units are respectively dissolved in a mixed solvent of 6 / 4 (mass ratio) of propylene glycol monomethyl ether acetate and propylene glycol monomethyl ether in a molar ratio of 30 / 10 / 60 to prepare 22% by mass monomer solution (400 g). Furthermore, 8 mol% of polymerization initiator V-601 (manufactured by Wako Pure Chemical Industries, Ltd.) rice was added and dissolved in the monomer solution. The resulting solution was added dropwise to the solvent 1 over 6 hours. After completion of the dropwise addition, the reaction was further carried out at 80° C. for 2 hours. After cooling the reaction solution, it was poured into 3600 ml of hexane / 400 ml of et...

Embodiment 1

[0401] Such as figure 1 As shown, the following device is assembled, that is, the flow path 5, the flow path 6, and the flow path 7 are used to connect the tank 1, the mercury 2, and the column 100 provided with the first filter, and then the flow meter 3 is arranged on the flow path 7, and the filling port 8, so that the processed resist composition can be filled into the processing liquid filling container 4. By driving the mercury 2, the resist composition contained in the tank 1 circulates in the lock system.

[0402] In Example 1, a polyethylene filter with a pore size of 10 nm was installed on the column 100 of the apparatus as the first filter. The resist composition Ar-1 shown in the above Table 4 was accommodated in tank 1, and the resist composition Ar-1 was circulated in the closed system of the flow of tank 1 → mercury 2 → column 100 by driving mercury 2 . Set the number of cycles to 5. Here, the number of cycles is set to [cumulative amount of the resist compo...

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PUM

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Abstract

The present invention addresses the problem of providing a method for manufacturing an actinic light sensitive or radiation sensitive resin composition, and the actinic light sensitive or radiation sensitive resin composition manufactured by the method. The method includes a filtration step in which the actinic light sensitive or radiation sensitive resin composition is filtered by being passed through a filter, and in this filtration step the actinic light sensitive or radiation sensitive resin composition is passed at least five times through a first filter having a hole diameter of 10 nm or less.

Description

technical field [0001] The present invention relates to an ultramicrolithography (microlithography) process or other fabrication processes that can be preferably used in the manufacture of VLSI (Large Scale Integration, LSI) or high-capacity microchips (microchip), and can be A method for producing an actinic radiation-sensitive or radiation-sensitive resin composition for forming a high-definition pattern, and an actinic radiation-sensitive or radiation-sensitive resin composition produced by the production method. Background technique [0002] If a resist pattern having a finer size of 50 nm or less is required in recent years, it is necessary to further improve the defects (surface defects) of the resist pattern after development in addition to the resolving power of the resist. The defect refers to all defects detected when the developed resist pattern is observed from directly above using a surface defect observation device (trade name "KLA") of KLA Tencor, for example....

Claims

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Application Information

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IPC IPC(8): G03F7/26G03F7/039
CPCG03F7/0397G03F7/11G03F7/16G03F7/2041
Inventor 藤森亨森弘喜
Owner FUJIFILM CORP