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Handheld non-contact soldering tin pen

A non-contact, soldering technology, used in tin feeding devices, welding equipment, metal processing, etc., can solve the problems of harsh welding conditions and complex processes, and achieve the effect of improving heating uniformity, ensuring full dissolution and reducing resistance.

Inactive Publication Date: 2016-11-16
XIAMEN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing non-contact welding process is complicated, limited to welding where the entire product can withstand high temperature and the pad is flat, and the welding conditions are harsh

Method used

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  • Handheld non-contact soldering tin pen
  • Handheld non-contact soldering tin pen
  • Handheld non-contact soldering tin pen

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Experimental program
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Embodiment Construction

[0028] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0029] Please refer to Figure 1 to Figure 7 , a hand-held non-contact solder pen, including a body 1, solder, a heating element 6, a nozzle 3 and an electrode 5, and the nozzle 3 is set at one end of the body 1. The body 1 is provided with a solder chamber 12, the nozzle 3 communicates with the solder chamber 12, the solder is accommodated in the solder chamber 12, and the heating element 6 is arranged on the body 1 for heating the solder. The solder chamber 12 is provided with two separate electrodes 5, and the electrodes 5 are connected to an external power source. After power is applied, the ion movement in the solder forms a current, and there is a magnetic field in the solder chamber 12. The ions are subjected to the Lorentz force and are directed toward the nozzle 3 .

[0030] A solder chamber 12 is provided on the body 1 , s...

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PUM

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Abstract

A handheld non-contact soldering tin pen comprises a body, soldering tin, a heating piece, a nozzle and electrodes. The nozzle is arranged at one end of the body. A soldering tin cavity is formed in the body. The nozzle communicates with the soldering tin cavity. The soldering tin is contained in the soldering tin cavity. The heating piece is arranged on the body and used for heating the soldering tin. The two separately-arranged electrodes are arranged in the soldering tin cavity and connected with an external power source. After power is on, ions in the soldering tin move to form current, a magnetic field exists in the soldering tin cavity, and the ions are subjected to the effect of lorentz force and point to the nozzle in the direction. By the adoption of the handheld non-contact soldering tin pen, the electrodes connected with the external power source are arranged in a soldering tin solution, so that the ions in an electrolyte move to form the current, and in combination with the effect of the magnetic field, the soldering tin solution can be subjected to the effect of Lorentz force to flow outside. Non-contact soldering tin is achieved, and the structure of a soldering tin device is optimized into the structure of the soldering tin pen. The handheld non-contact soldering tin pen has the beneficial effects that non-contact soldering is easy to achieve, and operation is convenient.

Description

technical field [0001] The invention relates to the technical field of logistics transportation, in particular to a hand-held non-contact soldering pen. Background technique [0002] Soldering technology is widely used and has been successfully operated in various industries of electronic products for decades, and it has also innovated more accurate high-density technology. At present, soldering methods for common electronic products include electric soldering iron, wave soldering, dip soldering, and reflow soldering after SMT placement. The latter three belong to the non-contact type, that is, the heating body does not directly contact the parts, and it has a good effect on plane welding such as circuit boards, which can speed up the production speed. However, the existing non-contact welding process is complicated, limited to welding where the whole product can withstand high temperature and the pad is flat, and the welding conditions are harsh. Therefore, a solder pen t...

Claims

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Application Information

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IPC IPC(8): B23K3/06B23K3/00
CPCB23K3/0607B23K3/00B23K2101/36
Inventor 罗志伟杨玉龙
Owner XIAMEN UNIV OF TECH