A kind of preparation method of boron-doped diamond powder
A technology of boron-doped diamond and diamond film, which is applied in the field of new material synthesis, can solve the problem of poor control of boron doping amount and achieve the effect of controllable boron doping amount
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0022] (1) Use acetone, ethanol and deionized water to ultrasonically clean the titanium sheet carrier for 15 minutes, and dry it;
[0023] (2) Put an ethanol solution with a concentration of 5 mg / mL boron powder into a beaker, oscillate ultrasonically for 30 minutes to form a dispersion, drop it on a titanium sheet, and dry it to obtain a substrate;
[0024] (3) Put the dried substrate on the sample stage in the reaction chamber, and pump the background vacuum to 1×10 -3 Above Pa. Introduce hydrogen, and adjust the pumping speed of the vacuum pump to maintain the air pressure in the reaction chamber at 30Torr;
[0025] (4) The filament material is selected as tantalum wire, heated to 2000-2200°C, the substrate temperature is 650-950°C, and the substrate surface is etched with hydrogen for 40 minutes;
[0026] (5) Keep the filament temperature and the substrate temperature constant, feed methane, the percentage of hydrogen is 1%, the flow rate is 1.5 / 100sccm, and the deposit...
Embodiment 2
[0030] (1) Use acetone, alcohol and deionized water to ultrasonically clean the titanium sheet carrier for 15 minutes, and dry it;
[0031] (2) Put an ethanol solution with a concentration of 12 mg / mL titanium diboride into a beaker, oscillate ultrasonically for 30 minutes to form a dispersion, drop it on a titanium sheet, and dry it to obtain a substrate;
[0032] (3) Put the dried substrate on the sample stage in the reaction chamber, and pump the background vacuum to 1×10 -3 Above Pa. Introduce hydrogen, and adjust the pumping speed of the vacuum pump, so that the pressure in the reaction chamber is maintained at 50 Torr;
[0033] (4) The filament material is tungsten wire, heated to 2000-2200°C, the substrate temperature is 650-950°C, and the substrate surface is etched with hydrogen for 30 minutes;
[0034] (5) Keep the filament temperature and the substrate temperature constant, feed methane, the percentage of hydrogen is 1.5%, the flow rate is 1.5 / 100sccm, and the dep...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 

