Preparation method for boron-doped diamond (BDD) powder
A boron-doped diamond and diamond thin film technology, applied in the field of new material synthesis, can solve the problems of poor control of boron-doped amount, etc., and achieve the effect of controllable boron-doped amount
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Embodiment 1
[0022] (1) Use acetone, ethanol and deionized water to ultrasonically clean the titanium sheet carrier for 15 minutes, and dry it;
[0023] (2) Put an ethanol solution with a concentration of 5 mg / mL boron powder into a beaker, oscillate ultrasonically for 30 minutes to form a dispersion, drop it on a titanium sheet, and dry it to obtain a substrate;
[0024] (3) Put the dried substrate on the sample stage in the reaction chamber, and pump the background vacuum to 1×10 -3 Above Pa. Introduce hydrogen, and adjust the pumping speed of the vacuum pump to maintain the air pressure in the reaction chamber at 30Torr;
[0025] (4) The filament material is selected as tantalum wire, heated to 2000-2200°C, the substrate temperature is 650-950°C, and the substrate surface is etched with hydrogen for 40 minutes;
[0026] (5) Keep the filament temperature and the substrate temperature constant, feed methane, the percentage of hydrogen is 1%, the flow rate is 1.5 / 100sccm, and the deposit...
Embodiment 2
[0030] (1) Use acetone, alcohol and deionized water to ultrasonically clean the titanium sheet carrier for 15 minutes, and dry it;
[0031] (2) Put an ethanol solution with a concentration of 12 mg / mL titanium diboride into a beaker, oscillate ultrasonically for 30 minutes to form a dispersion, drop it on a titanium sheet, and dry it to obtain a substrate;
[0032] (3) Put the dried substrate on the sample stage in the reaction chamber, and pump the background vacuum to 1×10 -3 Above Pa. Introduce hydrogen, and adjust the pumping speed of the vacuum pump, so that the pressure in the reaction chamber is maintained at 50 Torr;
[0033] (4) The filament material is tungsten wire, heated to 2000-2200°C, the substrate temperature is 650-950°C, and the substrate surface is etched with hydrogen for 30 minutes;
[0034] (5) Keep the filament temperature and the substrate temperature constant, feed methane, the percentage of hydrogen is 1.5%, the flow rate is 1.5 / 100sccm, and the dep...
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