Method for manufacturing low-resistance protective layer of chip type thin film fixed resistor

Abstract

The invention relates to a method for manufacturing a low-resistance protective layer of a chip-type thin-film fixed resistor. A uniform SiO2 protective film layer is deposited on a nickel-chromium resistor body film layer by using a SiO2 target material radio frequency sputtering method. The invention greatly improves the stability and reliability of the product; it significantly improves the use of the product in the harsh environment of high temperature and high humidity; the welding resistance of the product sputtered with Taiwan's low-resistance target material is significantly improved; Improve the consistency of low-resistance heat treatment, increase the heat treatment temperature, and have no effect on the positive and negative TCR of the product, which can be within ±5ppm/°C, so this method can be applied to products with a temperature characteristic of thin film resistance of ±5ppm/°C , so that the TCR qualification rate of the low-resistance segment of the chip film fixed resistor has been greatly improved, and the delivery efficiency of the product has been improved.

Description

technical field [0001] The invention relates to a method for manufacturing a chip-type film fixed resistor, in particular to a method for manufacturing a low-resistance protective layer of a chip-type film fixed resistor. Background technique [0002] After the original chip type thin film fixed resistor is deposited by sputtering, the resistor body film layer is not protected by other methods, and the low temperature resin paste is directly printed for encapsulation. [0003] Chinese patent, announcement number: 102820111A, name: chip film fixed resistor and its manufacturing method are disclosed. [0004] Chip-type film fixed resistors are low-resistance products that use nickel-chromium target sputtering resistance. In terms of resistance to soldering heat, due to different manufacturing methods of different targets, the difference in heat treatment temperature is large, and the difference in solder resistance is large. About 50% of the batches Solder resistance cannot m...

AI Technical Summary

Problems solved by technology

[0004] Chip-type film fixed resistors are low-resistance products that use nickel-chromium target sputtering resistance. In terms of resistance to soldering heat, due to different manufacturing methods of different targets, the difference in heat treatment temperature is large, and the difference in solder resistance is large. About 50% of the batches Solder resistance cannot meet the requirements of the specification (ΔR≤±0.2%R+0.01Ω), so how to improve the solder resistance of some low-resistance products has become an urgent problem for us to solve

[0005] From the perspective of batch production, due to the low resistance will react with oxygen in the air during the high temperature heat treatment process to form oxides, the surface of the resistor film layer will react unevenly during the oxidation process, so that the temperature coefficient of resistance is Y( ±10ppm / ℃) batch pass rate can only reach 70%