Bonding technology for wafer surface and semiconductor device structure
A bonding process and device structure technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc. Problems such as low degree of bond bonding can eliminate abnormal appearance and color, optimize thickness uniformity, and improve performance.
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[0035] The bonding process and semiconductor device structure of a wafer surface of the present invention will be described in more detail below in conjunction with flow charts and schematic diagrams, wherein a preferred embodiment of the present invention is represented, and it should be understood that those skilled in the art can modify the description herein the present invention, while still realizing the advantageous effects of the present invention. Therefore, the following description should be understood as the broad knowledge of those skilled in the art, but not as a limitation of the present invention.
[0036] In the following paragraphs the invention is described more specifically by way of example with reference to the accompanying drawings. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used ...
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