Silicon chip fast handing over device

A handover device and silicon wafer technology, which is applied in photolithographic process exposure equipment, transportation and packaging, instruments, etc., can solve the problems of not performing silicon wafer pre-alignment functions, reduce handover time, increase production capacity, and ensure high The effect of precision

Inactive Publication Date: 2016-11-23
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the silicon wafer transmission system in US20050095090A1 also adopts a direct rotation method to transfer to the workpiece table, in order to take the wafers from the warehouse, the manipulator also needs to move in the horizontal direction, and the silicon wafer transmission is only responsible for the silicon wafers. Transfer without silicon pre-alignment function

Method used

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Embodiment Construction

[0018] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0019] figure 1 It is a transmission layout diagram of the silicon wafer rapid transfer device of the present invention. Such as figure 1 As shown, the silicon wafer transfer system is composed of a pre-alignment unit 1 , a wafer storage unit 2 , an unloading buffer table 3 , a silicon wafer transfer manipulator 4 , and a silicon wafer transfer mechanism 5 . The pre-alignment unit 1 mainly realizes the centering and orientation of silicon wafers; the wafer storage unit 2 is mainly responsible for the storage of silicon wafers; the unloading cache table 3 realizes the caching of silicon wafers after exposure; the silicon wafer transfer robot 4 realizes the silicon wafer from the wafer storage The movement of silicon wafers between unit 2 to pre-alignment unit 1, and from the next buffer table 3 to the library unit 2.

[0020] Such as figure...

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Abstract

The invention discloses a silicon chip fast handing over device which is used for delivering silicon chips among a pre-alignment unit, a chip storehouse unit, a lower sheet buffer-storing platform and a workpiece platform. The silicon chip fast handing over device comprises a silicon chip transmission manipulator and a silicon chip handing-over mechanism. The silicon chip handing over mechanism comprises a plurality of rotary sleeves and a plurality of sheet forks; the rotary centers of the plurality of rotary sleeves are the same and the rotary sleeves are arranged by nesting; the top of each rotary sleeve is connected to one sheet fork for absorbing the silicon chip; each of the plurality of the sleeves can rotate around the rotation center; the sheet fork is of an U shape and the distance between the two edges of the sheet fork is greater than a maximum distance between silicon sheet absorption thimbles on the pre-alignment unit, the lower sheet buffer-storing platform and the workpiece platform. Compared with the prior art, the silicon sheet fast handing over device only rotates in the handing over process, and the sheet forks performs multi-point absorption, which guarantees high precision transmission and repeatability of the silicon chip. The single handing over sheet fork in the silicon sheet handing over mechanism can perform single movement, can realize a parallel movement through flow control, reduces handing over time and improves yield.

Description

technical field [0001] The invention relates to the field of integrated circuit equipment manufacturing, and in particular to a silicon chip fast handover device for a photolithography machine. Background technique [0002] With the continuous expansion of semiconductor process productivity requirements, the productivity requirements of semiconductor manufacturing equipment are also continuously increased. In semiconductor equipment, the silicon wafer is usually transferred to the silicon wafer table by the transfer manipulator of the silicon wafer, and then the silicon wafer table carries the silicon wafer and moves with the provided moving guide rail to complete a series of exposure actions and realize the photolithography of the silicon wafer. craft. During the whole process, the transfer manipulator downloads the exposed silicon wafer from the silicon wafer table and uploads the new silicon wafer. This action is called wafer handover. This time cannot be used as the eff...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677G03F7/20
CPCH01L21/67748G03F7/70733
Inventor 徐伟
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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