Glass material with low-weight-percentage zirconium oxide component

Abstract

The invention discloses a glass material with a low-weight-percentage zirconium oxide component. The glass material comprises a reinforcement material, a fluxing material and a main material. The reinforcement material comprises zirconium oxide (ZrO2) and aluminum oxide (Al2O3); the fluxing material comprises boric oxide (B2O3) and calcium oxide (CaO); the main material comprises silicon oxide (SiO2); the weight percentage of the zirconium oxide accounts for 0.001-2% of the glass material, the weight percentage of the aluminum oxide accounts for 10-18% of the glass material, the weight percentage of the boric oxide accounts for 20-35% of the glass material, the weight percentage of the calcium oxide accounts for 3-9% of the glass material, and the weight percentage of the silicon oxide is equal to the rest percentage of the glass material after subtraction of the weight percentages of the other materials of the glass material. Therefore, by addition of the zirconium oxide in the glass material, coefficient of thermal expansion can be decreased while strength of the glass material can be improved effectively.

Description

technical field [0001] The present invention relates to a glass material, in particular to a glass material with zirconia (ZrO2), and the zirconia (ZrO2) occupies a low weight percentage in the glass material. Background technique [0002] Printed circuit board (PCB) is an indispensable component in electronic products. Most of the substrates of existing printed circuit boards (PCB) are copper clad substrates (CCL). The main raw materials of the copper clad substrate are copper foil and glass fiber cloth. Among them, glass fiber cloth is woven by glass fiber weaving machine, and can be divided into thick cloth, thin cloth, ultra-thin cloth or cloth of special specifications according to the thickness. Electronic products are gradually developing in the direction of thinner and smaller, multi-functional, high-speed and high-frequency, so that the printed circuit boards used in electronic products must not only have a lower dielectric constant (DK) and a lower dissipation fact...

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Problems solved by technology

[0003] Glass is divided into various types according to the composition and proportion of the material. In the past, the raw material for making electronic-grade glass fiber was mostly "E-glass". The dielectric constant (Dielectric constant) and loss of E-glass Factor (Dissipation factor) is about 6.8 ~ 7.1 and 0.006 respectively, and its main component is SiO 2 、Al 2 o 3 , CaO, MgO and B 2 o 3 ... etc. Generally speaking, when those skilled in the art want to make glass fibers from a glass material, they first put the glass material into a heating furnace and heat it to the expected "viscosity temperature" to melt the glass material into a uniform After the glass paste, use a spinning box (Bushing) to separate the glass paste into glass fibers, wherein, in order to improve the strength of the glass fibers, those skilled in the art often add other oxides to the glass material, or is to increase Al 2 o 3 , B 2 o 3 However, the above-mentioned practice often leads to follow-up problems. First, when the content of the above-mentioned oxides, aluminum (Al), and boron (B) is too much, the thermal expansion coefficient of the glass will be too high, making the glass material produced. The glass fiber cannot meet the needs or electrical characteristics of the printed circuit board, and secondly, when the Al 2 o 3 When the content is high, in addition to increasing the temperature at which the glass material can be drawn, it will also increase the viscosity of the glass paste and make it difficult to draw, resulting in a decrease in the production yield of those skilled in the art, and it will increase the temperature of the glass paste for those skilled in the art. production cost

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