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Heat beam film-forming apparatus

A film-forming device and instant heating technology, applied in gaseous chemical plating, metal material coating process, coating, etc., can solve the problems of plastic or glass deformation, short distance, etc., achieve low-cost processes, and promote film formation Effect that reaction, reaction are easy

Inactive Publication Date: 2016-12-07
PHILTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0017] However, in the invention of Patent Document 6, since the distance between the substrate and the high-temperature heat exchange member made of carbon is short, there is a problem that radiant heat deforms plastic or glass.

Method used

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Experimental program
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Effect test

Embodiment approach

[0075] Below, refer to Figure 1 to Figure 4 , the embodiment of the present invention will be described. In addition, the film forming apparatus of the present invention can form a film even when the substrate is kept at a low temperature from room temperature to about 100°C.

[0076] figure 1 A schematic diagram showing the basic structure of the thermal beam film forming apparatus of the present invention. The carrier gas 201 of nitrogen is heated by the heat beam heating device 1 (203), and the heat beam heating device 1 (203) uses stainless steel as the material of the flow channel, and the stainless steel uses nickel, iron and chromium with catalytic functions as the main materials. Element. The heated generated gas reaches the guide 210 through the generated gas delivery pipe 204 .

[0077] Similarly, the source gas 205 is heated by the heat beam heating device 2 ( 207 ), and the heated generated gas is guided to the guide 210 through the delivery pipe 208 . The g...

Embodiment 1

[0084] First, an example for confirming the capability of the heat beam cylinder used will be shown.

[0085] The steam and raw methane gas preheated to above 130°C are introduced into the heat beam cylinder and further heated. The temperature of the gas in the heat beam cylinder at this time was set to 540°C. The heat beam cylinder can input a maximum of 1500W of electricity, and the maximum temperature can be raised to 1000°C. Into a 3 / 8 inch tube at the outlet of the cylinder was placed aluminum oxide columnar particles loaded with ruthenium and argon was used as the carrier gas.

[0086] In order to cool the temperature of the generated gas, a cooling mechanism and a water recovery mechanism are connected to the generated gas outlet. When the components of the cooled produced gas were analyzed, it was confirmed that about 30% of methane was changed and hydrogen was produced. The other components are carbon dioxide and carbon monoxide, and the concentration of carbon mon...

Embodiment 2

[0089] pass figure 1 A basic schematic diagram of the structure shown in the film formation. Orthosilicate ethyl (Si(OC 2 h 5 ) 4 : TEOS for short). Water in a cluster state is selected as the source gas of the oxidizing agent. The raw material is a liquid raw material, which is used by bubbling argon to vaporize it. Since it is a liquid, in order to prevent liquefaction in the middle of the transport channel, the raw material was transported with a carrier gas of nitrogen preheated to 150° C. by passing through the heat beam cylinder, and the raw material was used as a raw material gas. The gas is heated to 300°C by the heat beam cylinder installed in the decompression reaction chamber for reheating, and directed to the silicon wafer substrate at room temperature placed in the decompression reaction chamber, alternately combined.

[0090] Since the instantaneous heating mechanism of the raw material gas of the heat beam cylinder is made of SUS, it contains nickel, iro...

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Abstract

To form a film by generating molecular species which can react at a low temperature, especially, 100DEG C. or less at which a substrate is not deformed or altered. In a heat beam heating device which instantaneously heats a source gas to a high temperature to cause the source gas to collide with a metal wall including a catalytic function, activated molecular species are generated by a nonequilibrium reaction, sprayed on, and brought into contact with a substrate to form a film.

Description

technical field [0001] The present invention relates to a heat beam (ヒートビーム) film forming apparatus, which instantaneously heats a member at a temperature higher than that of a substrate to change a raw material gas to generate a gas, and directs the generated gas to the surface of a substrate to form a film. Background technique [0002] Usually, the chemical bond energy of the gas molecules is mostly above 3eV, and the gas molecules will not decompose only by heating the gas at a high temperature. However, when the gas heated to a high temperature collides vertically with a metal containing an element having a catalytic effect, the molecules of the gas tend to react. When a gas species that can chemically react on a catalyst is heated and collides with it, it can react to generate a gas of a different molecular type or form from the original gas (hereinafter referred to as a catalytic collision reaction). For example, if the gas obtained by instantaneously heating methane...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/452C23C16/34C23C16/40
CPCC23C16/34C23C16/402C23C16/452C23C16/45527C23C16/545C23C16/401
Inventor 古村雄二清水纪嘉西原晋治
Owner PHILTECH