LED lamp cooling device
A heat dissipation device and LED lamp technology, which is applied to lighting devices, cooling/heating devices of lighting devices, air-proof/waterproof devices, etc., can solve the problems of poor heat dissipation design of LED lamps, heavy heat sinks, and reduced service life. , to achieve the effects of easy promotion and use, high production efficiency, and slow down light decay
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Embodiment 1
[0013] The main structure of the heat dissipation device for LED lights involved in this embodiment includes: acrylic glass 1, LED lamp bead 2, driver casing 3, driver 4, LED substrate 5, radiator 6, light flexible heat dissipation film 7 and radiator casing 8 ;In an environment of 138-180°C, print the low-temperature solder paste on the welding position on the bottom surface of the LED substrate 5, and use a reflow soldering process to weld the LED lamp beads 2 to the LED substrate 5 on the side printed with the low-temperature solder paste; One end of the driver 4 is connected to the circuit board of the driver 4 through a conductive connection block, so that the conductive connection between the LED substrate 5 and the power supply of the driver 4 is tight and firm; the driver shell 3 covers the driver 4 for heat dissipation and protection; the acrylic glass 1 is snapped into the LED substrate 5 The LED lamp bead 2 is covered in the card slot on the bottom surface, and the c...
Embodiment 2
[0016] The structure of the radiator 6 in the main structure of the LED lamp heat dissipation device involved in this embodiment includes: a light and flexible heat dissipation film 7, a radiator shell 8, a left substrate 9, a right substrate 10, an upper substrate 11, a lower substrate 12, Front substrate 13, rear substrate 14, and louvered grille 15; 3 to 20 slots uniformly distributed on the lower substrate 4 that match the light and flexible heat dissipation film 7 are made, and the light and flexible heat dissipation film 7 is inserted into the slots , closely fit the outer side of the lower substrate 4, and adjust the reserved height of the upper end of the lightweight flexible heat dissipation film 7 according to actual needs; It is vulcanized and sealed with the upper base plate 3 to form an integral hollow structure radiator shell 8; several louvered grilles are respectively made on the left base plate 1, the right base plate 2, the upper base plate 3, the lower base p...
Embodiment 3
[0019] In this example, the temperature changes of the LED lamp heat sink device prepared in Example 1 and the zigzag die-casting aluminum heat sink LED device were respectively tested at 25°C, and a comparison chart of temperature change curves was made, as shown in image 3 As shown in curve 1, the heat dissipation area of the zigzag die-casting aluminum heat sink is 2000cm 2 , the weight is 3.5Kg, the cost is about 65 yuan, and the thermal conductivity is 113W / (m K), which can keep the surface temperature of the LED substrate at about 35.3°C; as shown in curve 2, the heat dissipation area of the graphene heat dissipation film device is 1200cm 2 , the weight is 1.12Kg, the cost is about 30 yuan, and the thermal conductivity is 1010W / (m·K), which can keep the surface temperature of the LED substrate at about 32°C. Comparing curves 1 and 2, it can be seen that compared with the LED heat sink using the graphene heat dissipation film and the LED heat sink using the zigzag di...
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