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Method for measuring residual stress of metal microstructure

A metal microstructure and residual stress technology, applied in measuring devices, force/torque/work measuring instruments, instruments, etc., can solve the internal atomic interaction, does not have vibration and rotational degrees of freedom, and cannot measure the residual stress of metal microdevices and other problems, to achieve the effect of expanding the scope of application, improving dimensional accuracy and production yield, and widening the scope of application

Active Publication Date: 2016-12-21
DALIAN UNIV OF TECH
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, metal is an atomic structure without vibration and rotation degrees of freedom. The plasma actually composed of electrons and atoms on the surface of the metal has a strong absorption of laser light, making it unable to interact with internal atoms. In theory, micro-Raman spectroscopy cannot measure Residual stress in metal microdevices

Method used

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  • Method for measuring residual stress of metal microstructure
  • Method for measuring residual stress of metal microstructure
  • Method for measuring residual stress of metal microstructure

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Embodiment Construction

[0023] The specific embodiments of the present invention will be described in detail below in conjunction with the technical solutions and accompanying drawings.

[0024] attached figure 1 It is a schematic diagram of a metal microspring mask plate used for photolithography. The overall size of the microstructure is 3.74mm×1.14mm, and the minimum line width of the spring is 25um. Based on attached figure 2 In the UV-LIGA process shown, the metal microstructure electroformed adhesive film was produced. later attached image 3 Co-deposition of solid particles with metal microstructures is performed in the micro-electroforming apparatus shown. A method for measuring the residual stress of metal microstructures, which comprises the following steps:

[0025] (1) Pretreatment of solid particles with Raman activity. First, weigh 20g of SiC solid particles with a particle size of 5um and pour them into a 500ml beaker, wash the solid particles with deionized water, and filter to ...

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Abstract

The invention discloses a method for measuring residual stress of a metal microstructure, belongs to the technical field of micro manufacturing, and relates to a method for measuring residual stress of a metal microstructure. Solid particles with Raman activity are preprocessed and are mixed with an electroforming liquid to form a suspending liquid for micro electroforming. By taking the solid particles as stress tracking signals, the residual stress of the metal micro structure is measured through micro Raman spectrometry. The metal micro structure is prepared through adding the solid particles with the Raman activity to perform codeposition with metal, the problem of the restriction of incapability of measuring the residual stress of the metal micro structure by use of an X ray diffraction method is solved, the scope of application of the micro Raman spectrometry in measurement of the residual stress is expanded, the method has the advantages of wide application scope, simplicity and high efficiency, and the dimension precision and the manufacturing yield of a metal micro device are improved.

Description

technical field [0001] The invention belongs to the technical field of micro-manufacturing, and relates to a method for measuring the residual stress of metal microstructures. Background technique [0002] In the process of making metal micro devices by micro-electroforming technology, residual stress will inevitably be generated in the micro-electroforming layer. Larger residual stress is likely to cause problems such as surface cracks, structural deformation, and overall shedding of micro-devices, which greatly reduces the yield and service life of micro-devices. [0003] MEMS metal micro-devices generally have a functional structural design, and their minimum feature size is on the order of microns. Currently, the most commonly used method for measuring the residual stress of metal deposits is the X-ray diffraction method. However, this method can only be used to measure samples with a structure size larger than 10mm×10mm, and the X-ray diffraction method cannot be used...

Claims

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Application Information

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IPC IPC(8): G01L5/00
CPCG01L5/0047
Inventor 杜立群宋畅罗磊陶友胜李庆峰
Owner DALIAN UNIV OF TECH
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