Surface treatment method for sputtering target material

A sputtering target and surface treatment technology, applied in the target field, can solve the problems of difficult cleaning and removal, slow water evaporation, etc., and achieve the effect of high cleanliness

Inactive Publication Date: 2017-01-04
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Pure oil-type cutting fluid or water-soluble cutting fluid is easy to adhere to a layer of grease on the surface of the sputtering target, which is difficult to clean and remov...

Method used

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  • Surface treatment method for sputtering target material
  • Surface treatment method for sputtering target material
  • Surface treatment method for sputtering target material

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Embodiment Construction

[0029] Through the analysis of the inventor, it is found that the turning process of the existing sputtering target surface treatment technology uses pure oil or water-soluble or pure water as the cutting fluid, but the pure oil or water-soluble cutting fluid may or Will react with the aluminum material of the sputtering target, or contain oily substances, which is difficult to clean, resulting in the formation of cutting fluid residues or water marks on the surface of the sputtering target. It is difficult to use cutting fluid dedicated to aluminum materials. Make sure that no cutting fluid remains on the surface of the sputtering target after processing, which will affect the final use of the sputtering target.

[0030] In order to solve the problem that cutting fluid residues or water marks are easily formed on the surface of the sputtering target when the cutting fluid of the existing turning technology is used, the inventor of the present invention has made further research o...

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PUM

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Abstract

The invention provides a surface treatment method for a sputtering target material. The surface treatment method comprises the following steps of: providing the sputtering target material, wherein the sputtering target material has been subjected to rough machining and semi-finishing, and the target material is pure aluminum or aluminum alloy; and adopting a turning process to carry out finish machining on the sputtering target material, and adopting anhydrous alcohol as a cutting fluid for finish machining so as to achieve effects of lubricating and cooling. The anhydrous alcohol is liable to volatilize, and does not remain on the surface of the sputtering target material after being volatized, so that high cleanliness and flatness of the surface of the finish-machined sputtering target material are met, and any requirement on other substance residues is avoided.

Description

Technical field [0001] The present invention relates to the technical field of target materials, in particular to a surface treatment method of a sputtering target material. Background technique [0002] Physical Vapor Deposition (PVD) is one of the most common processes in semiconductor chip manufacturing, and sputtering targets for PVD are wiring materials, liquid crystal flat panel displays, optical lenses, electronic imaging, solar cells and other manufacturing processes One of the most important raw materials in China, among them, the most widely used is ultra-high purity aluminum or aluminum alloy sputtering target. [0003] In the actual manufacturing process, the surface roughness of the target will directly affect the stability of the sputtering rate of the target, and the instability of the sputtering rate will result in uneven thickness of the film formed on the substrate; therefore, in order to ensure the quality of the film For stability, the surface finish of the spu...

Claims

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Application Information

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IPC IPC(8): B23B1/00B23Q11/10
CPCB23B1/00B23B2222/04B23Q11/1038
Inventor 姚力军潘杰相原俊夫大岩一彦王学泽胡军胜
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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