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A tube-band microcirculation radiator and a microcirculation heat exchange system

A heat sink and pipe belt type technology, which is applied in the direction of cooling/ventilation/heating transformation, modification through conduction heat transfer, electrical components, etc., can solve the problem that the heat sink cannot meet the heat dissipation requirements, etc., to save auxiliary power and facilitate installation , The effect of reducing the possibility of high temperature and hot spots

Active Publication Date: 2019-06-11
CRRC DALIAN INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that the traditional radiator proposed above cannot meet the heat dissipation requirements under the condition of high power and high heat flux density, and researches and designs a tube-and-belt microcirculation radiator and a microcirculation heat exchange system

Method used

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  • A tube-band microcirculation radiator and a microcirculation heat exchange system
  • A tube-band microcirculation radiator and a microcirculation heat exchange system
  • A tube-band microcirculation radiator and a microcirculation heat exchange system

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Embodiment Construction

[0036] Such as Figure 1 to Figure 3 Shown, a kind of pipe belt type microcirculation radiator, comprises the heat source module installation board 4 that is used to install heat source module 3, radiator installation board 5 and a plurality of microcirculation cooling modules 9, described heat source module installation board 4 and radiator The mounting plates 5 are fixed to each other and the main working medium cavity 6 for containing the working medium is formed inside. The microcirculation heat dissipation module 9 is a tubular structure with one end open and one end closed. The inside of the microcirculation dispersion module 9 is a working medium cavity 10. An installation port is provided on the radiator mounting plate 5, and the opening end of the microcirculation dispersion module 9 is installed at the mounting port on the radiator mounting plate 5, so that the division cavity 10 communicates with the main cavity 6, and the The outer wall of the microcirculation heat...

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Abstract

The invention discloses a corrugated tube type micro-circulation radiator and a micro-circulation heat exchange system, comprising a heat source module mounting plate, a radiator mounting plate and a plurality of micro-circulation radiator modules, wherein the heat source module mounting plate and the radiator mounting plate are mutually fixed; a main working medium cavity for accommodating working mediums forms in the heat source module mounting plate; secondary working cavities form in all micro-circulation radiator module; the secondary working cavities are connected with the main working medium cavity; radiating fins are arranged on the outer walls of the micro-circulation radiator modules; a main fluid absorption micro-channel with a capillary structure is arranged on the inner wall of the main working medium cavity; secondary fluid absorption channels with the capillary structure are arranged on the micro-circulation radiator modules; the main fluid absorption micro-channel is interconnected with capillary channels of the secondary fluid absorption channels. The corrugated tube type micro-circulation radiator and the micro-circulation heat exchange system have the advantages of compact structure, high transmission efficiency, relatively low noise, low auxiliary power consumption and high reliability and can well solve the main bottleneck problem in industrial development of electronic components, and thus the radiator and the system have bright market prospects.

Description

technical field [0001] The invention relates to a radiator, in particular to a tube-and-belt microcirculation radiator and a microcirculation heat exchange system. Background technique [0002] With the development of science and technology, the miniaturization and high integration of high-power and high-performance electronic component application systems have led to a sharp increase in the calorific value of electronic equipment per unit volume and excessive local temperatures. When electronic components are in a high temperature state for a long time, they often fail due to overheating. In addition, when the use environment has strict restrictions on the volume and weight of the heat exchange system and the heat dissipation requirements are still high, it is difficult for the traditional forced liquid circulation cooling method, forced air cooling method or gravity heat pipe phase change cooling method to meet the requirements of high power, The heat dissipation requirem...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20172H05K7/20336H05K7/2039
Inventor 孔丽君李建涛宗庆贺谷利亚任智达
Owner CRRC DALIAN INST CO LTD
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