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A cover tape for a carrier tape

A technology of cover tape and carrier tape, which is applied in applications, household appliances, and other household appliances. It can solve problems such as residual finished products, power loss, and environmental pollution, so as to avoid the use of toxic substances, slow down vibration, and reduce environmental pollution. Effect

Active Publication Date: 2019-02-12
ZHEJIANG JIEMEI ELECTRONICS & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The bonding layer generally adopts polyurethane adhesive (referred to as AC agent). Ethyl acetate is used as a solvent for AC agent coating. Although ethyl acetate is a low-toxicity substance, it always pollutes the environment to a certain extent and is easy to remain in the finished product. Above; the AC agent layer is liquid when it is applied, so it needs to be dried before continuing the follow-up procedure, which consumes power

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A cover tape for a carrier tape, comprising a base material layer for providing support, a heat-sealing layer located below the base material layer, and a connection layer connecting the base material layer and the heat-sealing layer, the The connection layer includes the following components in mass percentage: 75% ethylene-methyl acrylate, 15% polyethylene, 5% modified ethylene-octene copolymer, and 5% modified SEBS.

Embodiment 2

[0023] A cover tape for a carrier tape, comprising a base material layer for providing support, a heat-sealing layer located below the base material layer, and a connection layer connecting the base material layer and the heat-sealing layer, the The connecting layer includes the following components by mass percentage: 50% of the main material, which is a mixture of ethylene-methyl acrylate and ethylene-butyl acrylate, 25% modified polyethylene, 15% modified ethylene-octyl ethylene copolymer, 10% modified SEBS; wherein, polyethylene is low-density polyethylene, which is grafted and modified by grafting monomers, and the grafting rate is 8%, and the grafting monomers include maleic anhydride, Acrylic acid and methyl acrylate; ethylene-octene copolymers are modified by grafting of maleic anhydride to obtain modified ethylene-octene copolymers with a grafting rate of 2%; SEBS is grafted by maleic anhydride Modified to obtain modified SEBS, grafting rate of 10%.

Embodiment 3

[0025] A cover tape for a carrier tape, comprising a base material layer for providing support, a heat-sealing layer located below the base material layer, and a connection layer connecting the base material layer and the heat-sealing layer, the base material The layer adopts PET, and the connection layer includes the following components in mass percentage: 20% of the main material, which is a mixture of ethylene-butyl acrylate, ethylene-acrylic acid copolymer and ethylene-acrylic acid-maleic anhydride terpolymer , 40% modified polyethylene, 25% modified ethylene-octene copolymer, 15% modified SEBS; among them, low density polyethylene and metallocene polyethylene are mixed in a weight ratio of 1:0.5-1.5 , in this embodiment, the mixing ratio of the two is 1:1, and the grafting modification is carried out by grafting monomers, the grafting rate is 10%, and the grafting monomers are glycidyl methacrylate; ethylene-octene The copolymer is modified by grafting of maleic anhydrid...

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Abstract

The invention belongs to the field of packages of electronic components and devices and relates to an upper cover tape for a carrier tape. The upper cover tape comprises a substrate layer, a heat-seal layer and a connection layer, wherein the substrate layer is used for providing a supporting force, the heat-seal layer is located below the substrate layer, and the connection layer is used for connecting the substrate layer and the heat-seal layer; the connection layer contains the following ingredients in percentage by mass: 20% to 75% of main material, 15% to 40% of polyethylene, 5% to 25% of modified ethylene-octylene copolymer and 5% to 20% of modified SEBS (Styrene-Ethylene-Butadiene-Styrene block copolymer), wherein the main material is one or a mixture of more of ethylene-methyl acrylate, ethylene-ethyl acrylate, ethylene-butyl acrylate, ethylene-acrylate copolymer and ethylene-acrylate-maleic anhydride terpolymer. According to the upper cover tape for the carrier tape, the connection layer with a specific formula is adopted to replace the traditional adhesive, so that the consumption of toxic substances in the adhesive is avoided, and the environmental pollution is reduced; the connection effect is further improved, and the production process of the upper cover tape is simplified; the connection layer can also be used for excellently alleviating vibration generated during the stripping of the upper cover tape, so as to keep the stability of carrier tape stripping.

Description

technical field [0001] The invention belongs to the field of packaging of electronic components and relates to a cover tape for a carrier tape. Background technique [0002] The upper cover tape is heat-sealed and covers the recessed portion continuously formed on the carrier tape for accommodating electronic components, forming a closed space. The upper cover tape is generally a multi-layer structure, with polyester film (PET) as the base material, and then a thermoplastic resin layer is laminated after surface treatment such as corona discharge. When laminating thermoplastic resin layers, an adhesive layer is generally required to bond the substrate layer and the subsequent thermoplastic resin layer. The bonding layer generally uses polyurethane adhesive (referred to as AC agent). Ethyl acetate is used as a solvent for AC agent coating. Although ethyl acetate is a low-toxicity substance, it always pollutes the environment and is easy to remain in the finished product. Ab...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B7/04B32B27/20B32B27/06C08L23/08C08L23/06C08L51/06C08L51/00
CPCB32B7/04B32B27/08B32B27/20B32B2307/54B32B2457/00C08L23/0869C08L51/06C08L2205/02C08L2205/025C08L2205/035C08L23/06C08L51/006
Inventor 王龙王春洪陈梦秋吴赞
Owner ZHEJIANG JIEMEI ELECTRONICS & TECH