A new thermal drive online testing microstructure impact strength testing machine and testing method

Abstract

The invention discloses a novel thermally-driven on-line-testing microstructural impact strength testing machine and a detection method thereof. Instant microstructural impact strength testing is realized on the novel thermally-driven on-chip testing machine; and a thermally driven actuator is used for realizing self loading and unloading, so that human and chance factors are eliminated and thus the testing accuracy is improved substantially. Meanwhile, a large impact and a large-impact pulse width that are not easy to obtain by using the traditional method can be obtained by using the thermally driven actuator and a V-shaped amplification lever. According to a testing method provided based on the novel testing machine, same photoetching and same etching and releasing are carried out to guarantee that a tested sample of the on-chip testing machine and a functional device working practically have consistent impact strength, thereby eliminating an interference caused by a process error. For testing samples with different dimensions, dimensions of an impact mass block and a flexible long beam in the testing machine are adjusted to guarantee that a high-strength impact load can be generated by the testing machine. When an impact breaking accelerated speed is obtained, a practical breaking loaded deflection is recorded, a mechanical model is established by using commercial ansys software, and then loading displacement that is easy to record is substituted into the mechanical model to obtain an impact accelerated speed difficult to measure and a generated stress peak value.

Description

technical field [0001] The invention belongs to the field of micro-electro-mechanical systems (MEMS) processing technology, and designs a new type of thermally driven on-chip testing machine for detecting the impact strength of microstructures. A detection area containing the testing machine is added to a silicon chip with functional devices. The standard SOG (silicon on glass) process produces functional devices and testing machines. At the same time, the microstructure test samples produced under the same process conditions as the device functions are obtained on the testing machine. After the overall process is over, the impact strength of the samples is tested by the testing machine. The test obtains the process-related mechanical characteristic parameters of functional devices in real time and online. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS) is an important direction for the development and application of microelectronics technology. Nowada...

AI Technical Summary

Problems solved by technology

The impact strength test of the traditional MEMS sensor is a drop weight test. This kind of experimental method requires the sensor to be split and packaged after the production process is completed. cycle

At the same time, this type of traditional impact detection method is very destructive. After the sensor chip has undergone such traditional method detection, a large area of ​​structural damage will occur, and it is impossible to find the most impact weak point in the structure.

Not only that, limited by the principle of loading generation, it is difficult for traditional shock detection methods to obtain high shock peak (greater than 100,000g) and large shock pulse width (s magnitude) loading. However, in the actual military application environment, such Severe shock environments are common

Therefore, the traditional impact detection method has obvious limitations.

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