Preparation method of copper-tungsten alloy and CuW-CrCu integrated material

A technology of copper-tungsten alloy and monolithic material, which is applied in the preparation of copper-tungsten alloy and CuW-CrCu monolithic material prepared by copper-tungsten alloy, can solve the problems of high loose packing density, high density of CuW alloy, difficult to compact and compact, etc. The effect of enhanced arc erosion, improved withstand voltage strength, and improved bonding strength

Inactive Publication Date: 2017-02-08
XIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

CuW alloys prepared with tungsten powders of different particle sizes have their own advantages and disadvantages: CuW alloys prepared with submicron tungsten powders have high hardness and high electrical conductivity, but the preparation process is extremely cumbersome. The energy is too high and the bulk density is too small, so it is difficult to compact it by conventional cold pressing methods, and it is easy to bring too much impurities in the air during the pressing process, which seriously affects the performance of the alloy.
Micron-sized tungsten powder is easier to handle, and the process of preparing CuW alloy is relatively simple and easy. It is the most widely used and most conventional CuW alloy in electrical contact materials, but its alloy performance is not the best.
The CuW alloy prepared by ultra-micron tungsten powder has high strength, but its matrix has poor continuity and is prone to copper-rich phases, and because of its excessive bulk density, the prepared CuW alloy has a high density, which is difficult to apply in actual production

Method used

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  • Preparation method of copper-tungsten alloy and CuW-CrCu integrated material
  • Preparation method of copper-tungsten alloy and CuW-CrCu integrated material
  • Preparation method of copper-tungsten alloy and CuW-CrCu integrated material

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preparation example Construction

[0025] The preparation method of copper-tungsten alloy of the present invention is specifically implemented according to the following steps:

[0026] Step 1, transfer submicron tungsten powder, micron tungsten powder, ultramicron tungsten powder and induced Cu powder into the mixer, add stainless steel grinding balls, wherein the mass ratio of the total powder mass to the stainless steel grinding balls is 1 : 1~5, mix powder at 100~200r / min for 4~8h; mass ratio of submicron tungsten powder, ultramicron tungsten powder, micron tungsten powder is 1:1:0.5~5, induce Cu powder The amount added is 10% to 15% of the total mass of tungsten powder;

[0027] In step 2, the powder mixed in step 1 is subjected to organic bonding treatment, dried, and sieved with a 200-mesh sieve to obtain a mixed powder;

[0028] Step 3, pressing the mixed powder obtained in step 2 through a cold pressing die, the pressing pressure is 300-350KN, and the pressure is maintained for 30-60 seconds to form a...

Embodiment 1

[0037] Step 1, put submicron tungsten powder, micron tungsten powder, ultramicron tungsten powder and induced Cu powder into the mixer, add stainless steel grinding balls, wherein the mass ratio of the total powder mass to the stainless steel grinding balls is 1: 1. Mix the powder for 4 hours at a speed of 100r / min; the mass ratio of submicron tungsten powder, ultramicron tungsten powder and micron tungsten powder is 1:1:0.5, and the amount of induced Cu powder added is 1% of the total mass of tungsten powder 10%;

[0038] In step 2, the powder mixed in step 1 is subjected to organic bonding treatment, dried, and sieved with a 200-mesh sieve to obtain a mixed powder;

[0039] Step 3, pressing the mixed powder obtained in step 2 through a cold pressing die, the pressing pressure is 300KN, and the pressure is held for 40 seconds to form a blank;

[0040]Step 4, put the blank obtained in step 3 in a high-purity graphite crucible, and place a copper block on the blank, and carry ...

Embodiment 2

[0044] Step 1, put submicron tungsten powder, micron tungsten powder, ultramicron tungsten powder and induced Cu powder into the mixer, add stainless steel grinding balls, wherein the mass ratio of the total powder mass to the stainless steel grinding balls is 1: 2. Mix the powder at a speed of 120r / min for 8 hours; the mass ratio of submicron tungsten powder, ultra-micron tungsten powder and micron tungsten powder is 1:1:5, and the amount of induced Cu powder added is 1% of the total mass of tungsten powder. 12%;

[0045] In step 2, the powder mixed in step 1 is subjected to organic bonding treatment, dried, and sieved with a 200-mesh sieve to obtain a mixed powder;

[0046] Step 3, pressing the mixed powder obtained in step 2 through a cold pressing die, the pressing pressure is 320KN, and the pressure is maintained for 50 seconds to form a blank;

[0047] Step 4, put the blank obtained in step 3 in a high-purity graphite crucible, and place a copper block on the blank, and...

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Abstract

The invention discloses a preparation method of a copper-tungsten alloy. The preparation method of the copper-tungsten alloy comprises the following steps: mixing submicron tungsten powder, micron tungsten powder, ultra-micron tungsten powder and induction Cu powder, bonding, drying and sieving to obtain mixed powder; pre-pressing the mixed powder to form a blank and then carrying out sintering infiltration on the blank to obtain the copper-tungsten alloy. A preparation method of a CuW-CrCu integrated material comprises the following steps: adding the prepared CuW alloy and a CrCu material in a high-purity graphite crucible, sintering under hydrogen protection atmosphere, then carrying out solid solution treatment and aging to obtain the CuW-CrCu integrated material. Through the preparation method of the copper-tungsten alloy, different contents of submicron tungsten powder and ultra-micron tungsten powder are added into conventional micro tungsten powder to prepare the multi-size CuW alloy; the conductivity of the prepared alloy is obviously improved and exceeds the national standard by 30%-50%; the arc erosion resistance of the prepared CuW alloy under the scheme is improved; the voltage resistance strength of the prepared CuW alloy is slightly improved; the bonding strength of the prepared CuW-CrCu integrated material is obviously improved.

Description

technical field [0001] The invention belongs to the technical field of alloy material preparation, and in particular relates to a method for preparing a copper-tungsten alloy. The invention also discloses a method for preparing a CuW-CrCu monolithic material from the copper-tungsten alloy prepared by the method. Background technique [0002] Copper tungsten (CuW) electrical contacts are the contact elements of electrical switches, mainly responsible for the task of contacting and disconnecting the load current. The safety, reliability, breaking and making characteristics of a switch largely depend on the physical properties of the contact material and its electrical properties. CuW-based contact materials are widely used in various circuit breakers because of their good arc erosion resistance, welding resistance and high strength. For components of load switches and transformer transfer switches, CuW-CrCu integral contact materials are especially widely used. [0003] Nowa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/04C22C27/04B22F1/00B22F3/10B22F7/08C22F1/18H01H1/04
CPCH01H1/04C22C1/045C22C27/04C22F1/18B22F3/1007B22F3/1035B22F7/08B22F2998/10B22F2999/00B22F1/052B22F2201/013B22F3/02
Inventor 邹军涛王媛媛梁淑华肖鹏杨晓红赵聪
Owner XIAN UNIV OF TECH
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