Complex conductive oxide-modified copper-based electric contact material and preparation method thereof
A technology of conductive oxides and electrical contact materials, applied in contacts, circuits, electrical switches, etc., can solve the problems of short life of breaking contacts of low-voltage electrical switches
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specific Embodiment approach 1
[0031] Specific Embodiment 1: The complex conductive oxide modified copper-based electrical contact material in this embodiment is characterized in that the complex conductive oxide-modified copper-based electrical contact material is composed of 2% to 15% complex conductive oxide, 0.004% to 0.01% of lanthanum, 0.1% to 0.3% of zirconium and the balance of copper; the molecular formula of the complex conductive oxide is Zn x Cd (2-x) SnO 4 , x in the molecular formula is 0-2.
[0032] The beneficial effects of this embodiment are:
[0033] 1. This embodiment adopts the principle of complex conductive oxide as the second phase and matrix alloying for material design, and realizes material preparation through liquid phase in-situ synthesis, co-deposition and subsequent heat treatment to obtain high arc ablation resistance, A new type of copper-based electrical contact material with low and stable contact resistance; the complex conductive oxide modified copper-based electrical...
specific Embodiment approach 2
[0041] Specific embodiment two: the preparation method of complex conductive oxide modified copper-based electrical contact material in this embodiment is specifically carried out according to the following steps:
[0042] 1. Weigh cadmium acetate dihydrate, zinc acetate dihydrate, five Tin chloride hydrate and copper alloy powder; said complex conductive oxide has the molecular formula Zn x Cd (2-x) SnO 4 , x in the molecular formula is 0~2;
[0043] 2. Dissolve the cadmium acetate dihydrate, zinc acetate dihydrate and tin chloride pentahydrate in the step 1 respectively in distilled water to obtain a concentration of 1.55M~1.65M cadmium acetate solution and a concentration of 1.55M~1.65M acetic acid Zinc solution and tin chloride solution with a concentration of 0.75M ~ 0.85M; mix cadmium acetate solution, zinc acetate solution and tin chloride solution, then add copper alloy powder and distilled water, in a water bath with a temperature of 60°C ~ 85°C Stir to obtain a s...
specific Embodiment approach 3
[0049] Embodiment 3: This embodiment differs from Embodiment 2 in that: the particle size of the copper alloy powder in step 1 is 25-44 μm. Other steps and parameters are the same as in the second embodiment.
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