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A kind of solder resist ink for LED exposure machine and preparation method thereof

A technology of solder resist ink and exposure machine, which is applied in the direction of optomechanical equipment, ink, optics, etc. It can solve the problems of high energy consumption, long start-up time and exposure time, and the singleness of the light source of LED exposure machine, etc., and achieve high adhesion , Low odor effect

Active Publication Date: 2019-09-10
江门市阪桥电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When transferring solder resist ink graphics, the traditional exposure machine takes a long time to start up and expose, and consumes a lot of energy. LED exposure machine can solve these problems very well, but the light source of LED exposure machine is relatively single. In order to meet the requirements of LED According to the working requirements of the exposure machine, it is necessary to develop an ink that meets the requirements of the LED exposure machine.

Method used

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  • A kind of solder resist ink for LED exposure machine and preparation method thereof
  • A kind of solder resist ink for LED exposure machine and preparation method thereof
  • A kind of solder resist ink for LED exposure machine and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8

[0037] A solder resist ink for an LED exposure machine, comprising the components shown in Table 1 in parts by weight.

[0038] The preparation method of the photosensitive resin is: by weight, 300 parts of solvent, 300 parts of epoxy resin, 110 parts of acrylic acid, 0.1 part of hydroquinone are added in the reaction kettle, heated to 105 ° C, and then the catalyst amine is added, After reacting for 10 hours, 60 parts of tetrahydrophthalic anhydride was finally added and reacted for another 4 hours to finally obtain a photosensitive resin with an acid value of 50 mgKOH / g and a solid content of 60%.

[0039] A preparation method of solder resist ink for LED exposure machine, comprising the following steps:

[0040] (1) Take photosensitive resin, acrylic monomer 1, acrylic monomer 2, epoxy resin, photoinitiator, auxiliary agent, solvent, pigment and filler by weight;

[0041] (2) each component weighed in the step (1) was dispersed for 50 minutes with a dispersion speed of 600...

Embodiment 9

[0053] A solder resist ink for an LED exposure machine, comprising the components shown in Table 1 in parts by weight.

[0054] The preparation method of the photosensitive resin used is: by weight, 300 parts of solvent, 280 parts of epoxy resin, 110 parts of acrylic acid, 0.1 part of hydroquinone are added to the reaction kettle, heated to 105 ° C, and then the catalyst is added Bean amine, reacted for 10 hours, finally added 100 parts of tetrahydrophthalic anhydride, and reacted for another 4 hours to finally obtain a photosensitive resin with an acid value of 55 mgKOH / g and a solid content of 62%.

[0055] The method for preparing the solder resist ink for LED exposure machine is the same as that of Example 1.

[0056] The method of printing the solder resist ink with the LED exposure machine on the PCB to form a solder resist film is the same as that in Example 1.

Embodiment 10

[0058] A solder resist ink for an LED exposure machine, comprising the components shown in Table 1 in parts by weight.

[0059]The preparation method of the photosensitive resin used is: by weight, 300 parts of solvent, 320 parts of epoxy resin, 110 parts of acrylic acid, 0.1 part of hydroquinone are added to the reaction kettle, heated to 105 ° C, and then the catalyst is added Bean amine, reacted for 10 hours, finally added 60 parts of tetrahydrophthalic anhydride, reacted for 4 hours, finally obtained the photosensitive resin with an acid value of 55mgKOH / g and a solid content of 62%.

[0060] The method for preparing the solder resist ink for LED exposure machine is the same as that of Example 1.

[0061] The method of printing the solder resist ink with the LED exposure machine on the PCB to form a solder resist film is the same as that in Example 1.

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Abstract

The invention relates to the field of ink, in particular to solder resist ink for an LED (Light Emitting Diode) exposure machine and a preparation method thereof. The ink mainly comprises the components in parts by weight: 35-50 parts of photosensitive material, 4-10 parts of acrylic monomer 1, 1-8 parts of acrylic monomer 2, 4-8 parts of epoxy resin, 1-4 parts of pigment, 20-35 parts of a filler, 6-10 parts of a photoinitiator, 1-5 parts of an adjuvant and 5-15 parts of solvent. The preparation method comprises the following steps: uniformly dispersing the raw materials, then grinding the dispersed raw materials, and filtering to obtain an ink finished product. The ink finished product is especially suitable for the LED exposure machine. The solder resist ink for the LED exposure machine has the advantages of high temperature resistance, acid and alkali resistance, hot-oil resistance and high adhesive force.

Description

technical field [0001] The invention belongs to the field of ink, and in particular relates to a solder resist ink for an LED exposure machine and a preparation method thereof. Background technique [0002] Exposure machine is an essential equipment for the modern manufacture of printed circuit boards (PCB). In the printed circuit board manufacturing process, one of the most critical processes is to transfer the negative image to the copper-clad substrate. When transferring the solder resist ink pattern, the traditional exposure machine has a long start-up time and exposure time, and consumes a lot of energy. The LED exposure machine can solve these problems very well, but the light source of the LED exposure machine is relatively single. To meet the working requirements of the exposure machine, it is necessary to develop an ink that meets the requirements of the LED exposure machine. Contents of the invention [0003] In view of the problems existing in the prior art, th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/101C09D11/107C09D11/102G03F7/027
Inventor 周中涛
Owner 江门市阪桥电子材料有限公司
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