Nitrogen cooling system of furnace tube, and cooling method for wafer and wafer boat

Abstract

The invention discloses a nitrogen cooling system of a furnace tube, and a cooling method for a wafer and a wafer boat. The cooling method comprises the steps of: setting two paths of cooling pipelines in the nitrogen cooling system, wherein each path of cooling pipeline adopts a quality flow controller for controlling a nitrogen flow; and setting different nitrogen flows in the two paths of cooling pipelines, so that the nitrogen flow ejected out from each gas outlet of a first cooling pipe for cooling the wafer boat is less than the nitrogen flow ejected out from each gas outlet of a second cooling pipe for cooling the wafer, thus particles generated at the boat foot part of the wafer boat are blown off by the small-flow nitrogen ejected from the first cooling pipe and then blown away by the large-flow nitrogen ejected from the second cooling pipe. Therefore, the wafer boat and the wafer on the wafer boat can be effectively cooled, and the particles at the boat foot part of the wafer boat can be prevented from being blown onto the wafer.

Description

technical field [0001] The invention relates to the technical field of semiconductor integrated circuit processing, more specifically, to a nitrogen cooling system for furnace tubes and a method for cooling wafers and wafer boats using the system. Background technique [0002] Integrated circuits continue to develop in the direction of high density. On a smaller and smaller chip, more and more components are integrated, making the chip less and less tolerant to defects, and more and smaller defects are gradually becoming A yield killer. [0003] The defects of integrated circuits are the physical pollution and defects existing on the wafer, mainly including: foreign matter on the wafer (dust, process residues, adverse reaction products, etc.), graphic defects (abnormal imaging caused by lithography or etching), , Mechanical scratch deformation, abnormal color caused by uneven thickness, etc.), chemical pollution (residual chemicals, organic solvents, etc.), material defects...

AI Technical Summary

Problems solved by technology

[0015] Since the flow rate of nitrogen gas injected from each air outlet of the shorter cooling pipe is larger than that of each air outlet of the longer cooling pipe, the particles generated by the friction of the boat feet will be blown onto the wafer , and it is difficult to be blown away by the smaller flow of nitrogen injected from the longer cooling tube, thus affecting the yield of the wafer

Images