Working medium contact cooling system for computer and data center heat radiation

Abstract

The present invention relates to a working medium contact cooling system for computer and data center heat radiation. The system comprises: a server cabinet; a liquid working medium case located at the bottom of the server cabinet; multiple layers of clapboards which are mutually paralleled and horizontally arranged and are hollow or have backflow channels, wherein the server assembly is arranged on the clapboards; a main pipe liquid dispenser being vertically arranged and being communicated with the liquid working medium case through a main pipe; and a plurality of liquid working medium shower pipes which are uniformly provided with a plurality of spraying ports, are horizontally arranged and located above each server assembly, and are communicated with the main pipe liquid dispenser, wherein the spraying directions of the spraying ports correspond to the position of the server assemblies, and the spraying ports spray the liquid working medium on the sever assemblies back to the liquid working medium case. The foggy liquid-state heat conduction working medium is directly contacted with the heating surface of the server assemblies without any intermediate medium and heat transferring links so as to substantially improve the heat exchange efficiency.

Description

technical field [0001] The invention relates to a working medium contact cooling system for heat dissipation of computers and data centers, and belongs to the field of heat dissipation systems of computers and data centers. Background technique [0002] With the rapid development of the communications and electronics industries, high-density server deployment is an inevitable trend in the construction and development of data centers. At the same time, high-efficiency computers suitable for various applications are also being introduced. Computing core components such as server components, processors, and memories are also developing towards small integration and high power density. While the components have high power performance, the heat dissipation problem is more prominent than before. If the heat dissipation problem cannot be effectively solved, it will inevitably restrict the further development of high-performance data centers. In the current technical field, traditi...

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a working fluid contact cooling system for heat dissipation of computers and data centers, which overcomes the problems of large heat generation in a single cabinet or excessive heat in a small range of several cabinets and unreasonable problems in the prior art. Due to the airflow organization, there will be local high heat that cannot be solved by the air conditioning system, which will cause the junction temperature of electronic devices to be too high, resulting in the deterioration or failure of device performance.

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