A high-efficiency and flexible sapphire multi-wire cutting machine

Abstract

The invention relates to the technical field of jewel cutting, in particular to an efficient multi-wire sapphire sawing machine flexible in cutting. The efficient multi-wire sapphire sawing machine flexible in cutting comprises a box. A bottom plate is horizontally arranged at the bottom of the box. The upper surface of the bottom plate is provided with a panel. A second linear motor is connected with one side of the panel through a slide block and fixedly arranged on the upper surface of the bottom plate. The upper surface of the panel is connected with a third installing plate through a connecting frame. Two cutting wheels are arranged on the third installing plate in a spaced mode, and two parallel second slide rails are vertically arranged on the third installing plate and connected with a second movable plate through slide blocks. The efficient multi-wire sapphire sawing machine flexible in cutting has the advantages of being compact in structure, reasonable in design, convenient to use and the like; the whole machine is stable during operation; and during cutting, a cutting device and a machined workpiece can reciprocate, so that cutting is flexible.

Description

technical field [0001] The invention relates to the technical field of gem cutting, in particular to a sapphire multi-wire cutting machine with high efficiency and flexible cutting. Background technique [0002] The multi-wire cutting machine is widely used in the slice production of single polycrystalline silicon materials in the photovoltaic industry. It uses a cutting fluid composed of SIC micropowder and polyethylene glycol to grind and slice silicon materials through steel wire transportation. It has high production efficiency, The characteristics of low cost. For the sapphire material widely used in the field of LED light sources, because its hardness is similar to that of SIC, SIC powder has no cutting ability for sapphire, and ordinary silicon material cutting machines are not suitable for sapphire slicing, and steel wires with electroplated diamond powder are usually used to The sapphire is sliced, the diamond micropowder is electroplated on the basic steel wire, t...

AI Technical Summary

Problems solved by technology

[0003] The cutting process of silicon material and sapphire material is different. The cutting process of silicon material is: copper-plated steel wire is used to improve the transportation capacity of cutting fluid, and the steel wire moves to transport SIC powder in cutting fluid to grind and cut silicon material. SIC powder Particles are rolling during cutting. SIC cutting fluid requires strong adhesion to steel wire and cooling and heat dissipation functions. The cutting fluid conveyed by steel wire requires uniformity. When cutting sapphire materials, the particles are relatively fixed during micro-powder cutting. If the slag does not drain smoothly, or adheres to the electroplated diamond wire, it will seriously affect the cutting ability of the diamond micro-powder electroplating line.

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