Stack type single base island SIP (System in Package) packaging process

Abstract

The invention discloses a stack type single-base island SIP (System in Package) packaging process. The process comprises the following steps: step I, taking a frame with a single base island; step II, welding a pin group on the frame, and cutting pin connection ends to form a lead frame; step III, dispensing a soft weld material on the single base island of the lead frame; step IV, pasting a first chip to the single base island with the soft weld material, and heating to melt the soft weld material so as to weld the first chip with the lead frame; step V, dispersing insulating glue to the surface of the first chip; step VI, pasting a second chip to the surface of the first chip, and bonding the second chip with the first chip through the insulating glue; step VII, connecting the first chip with the second chip through a metal line, connecting the first chip with the pins, and connecting the second chip with the pins; and step VIII, completing later procedures of packaging, cleaning and cutting. By adopting the stack type single system in package SIP packaging process disclosed by the invention, the heat radiation property of an integrated circuit can be improved, and the problem that a large space can be occupied by a power supply management chip can be solved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and in particular relates to a stacked single-base island SIP packaging process, which is mainly applied to intelligent control integrated circuits used in mobile phone chargers and LED constant-current power supplies. Background technique [0002] At present, the packaging forms of intelligent control integrated circuits used in mobile phone chargers and LED constant current power supplies are DIP8L, DIP7L, SOP8L, SOP7L, etc. Paste the MOS chip. However, as the power of mobile phone chargers is getting larger and larger, the existing technology can no longer meet the needs in the field of mobile phone chargers with increasingly fast charging and high power, and LED control due to the use of the original packaging form: [0003] 1. After high power, the original packaging form has poor heat dissipation. At present, the SOP series can only achieve 7-8W, and the DIP series can only...

AI Technical Summary

Problems solved by technology

However, as the power of mobile phone chargers is getting larger and larger, the existing technology can no longer meet the needs in the field of mobile phone chargers with increasingly fast charging and high power, and LED control due to the use of the original packaging form:

[0003] 1. After high power, the original packaging form has poor heat dissipation. At present, the SOP series can only achieve 7-8W, and the DIP series can only achieve about 7-15W. If the power is too large, it is easy to cause overheating damage;

[0004] 2. After the power is increased, the area of ​​the MOS chip will also increase. Since the original packaging form adopts the horizontal arrangement of double-base islands, the size of the high-power MOS chip cannot be attached to the existing package frame base island.

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