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Field effect transistor

A technology of field effect transistors and laminates, which is applied in the direction of transistors, semiconductor devices, semiconductor/solid state device manufacturing, etc., can solve the problems of uneven operation, insufficient suppression of ringing phenomenon and surge voltage, and inability to realize stable operation of field effect transistors and other problems, to achieve the effect of suppressing ringing phenomenon, suppressing surge voltage, and stabilizing work

Active Publication Date: 2017-02-22
ROHM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] However, in the field effect transistors of Patent Document 1 and Patent Document 2, the gate electrode pad is connected only to one end side of the gate electrode.
Therefore, when a field effect transistor is used as a switching device, a signal delay occurs in the field effect transistor, and it does not work uniformly
Therefore, there is a problem that the ringing phenomenon and the surge voltage cannot be sufficiently suppressed, and stable operation of the field effect transistor cannot be realized.

Method used

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no. 1 approach

[0027] figure 1 It is a schematic plan view of a GaN-based HFET (Heterojunction Field Effect Transistor) according to the first embodiment of the present invention. figure 2 yes means figure 1 A sectional view of the A-A line section.

[0028] Such as figure 2 As shown, in the first embodiment, a buffer layer 2 , a GaN layer 3 and an AlGaN layer 4 are sequentially formed on a Si substrate 1 . The GaN layer 3 and the AlGaN layer 4 constitute a GaN-based laminated body 5 having a heterojunction. 2DEG (two-dimensional electron gas) is generated at the interface between the GaN layer 3 and the AlGaN layer 4 to form a channel. In addition, the aforementioned substrate is not limited to a Si substrate, and a sapphire substrate or a SiC substrate may also be used, and the GaN-based laminated body 5 may be grown on a sapphire substrate or a SiC substrate, or may be used, for example, on a GaN substrate. The GaN-based stacked body 5 is grown on a substrate made of a nitride se...

no. 2 approach

[0045] image 3 It is a schematic plan view of the GaN-based HFET of the second embodiment described above. The points different from the first embodiment described above will be described. In the second embodiment, resistive elements 217 and 217 are connected to the first wiring 222 of the gate electrode connection wiring 221 . In addition, in this second embodiment, the same reference numerals as in the above-mentioned first embodiment denote the same configurations as in the above-mentioned first embodiment, and description thereof will be omitted.

[0046] Such as image 3 As shown, both ends of the first wiring 222 of the gate electrode connecting wiring 221 are respectively connected to the gate electrode pad 16 via a part of the second wiring 223 of the gate electrode connecting wiring 221 . Resistive elements 217 and 217 are respectively connected to both ends 222A and 222B of the first wiring 222 . The sheet resistance values ​​of the resistive elements 217 and 217...

no. 3 approach

[0049] Figure 4 It is a schematic plan view of the GaN-based HFET of the above-mentioned third embodiment. The difference from the above-mentioned first embodiment will be described. In this third embodiment, the first wiring 322 of the gate electrode connection wiring 321 is not connected to the resistance elements 217, 217, and both ends of the first wiring 322 Sections 322A, 322B constitute an impedance adjustment section. In addition, in this third embodiment, the same reference numerals as in the above-mentioned first embodiment denote the same configurations as in the above-mentioned first embodiment, and description thereof will be omitted.

[0050] Such as Figure 4 As shown, both ends of the first wiring 322 of the gate electrode connecting wiring 321 are respectively connected to the second wiring 323 of the gate electrode connecting wiring 321 . Both ends 322A, 322B of the first wiring 322 are bent and formed in a meandering manner. The CR time constant of the ...

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Abstract

The invention discloses a field effect transistor (GaN HFET) which is provided with: a gate electrode (13); a gate electrode pad (16); a first wiring (22) that connects one end of the gate electrode (13) to the gate electrode pad (16); a second wiring (23) that connects the other end of the gate electrode (13) to the gate electrode pad (16); and a resistor element (17) that is connected to the first wiring (22) and can adjust the impedance of the first wiring (22).

Description

technical field [0001] The present invention relates to GaN-based field effect transistors. Background technique [0002] Conventionally, as a GaN-based field effect transistor, there is a field effect transistor described in Patent Document 1 (JP-A-2010-186925). The field effect transistor such as Figure 5 As shown, a drain electrode 51 , a source electrode 52 , a gate electrode 53 , a gate electrode pad 54 , a gate wiring 55 and a resistance element 56 are included. A plurality of gate electrodes 53 are provided in a finger shape, and a gate wiring 55 connected to one end side of each gate electrode 53 is connected to a gate electrode pad 54 via a resistance element 56 . Also, when a field effect transistor is used as a switching device, the occurrence of ringing and surge voltage is suppressed by the resistance element 56 . [0003] In addition, conventionally, there is a field effect transistor described in Patent Document 2 (Japanese Patent Application Publication No...

Claims

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Application Information

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IPC IPC(8): H01L21/338H01L21/336H01L29/778H01L29/78H01L29/786H01L29/812
CPCH01L29/78H01L29/786H01L29/402H01L29/42376H01L29/4238H01L29/452H01L29/7786H01L29/2003H01L29/778H01L23/528H01L23/64H01L29/205H01L29/41758
Inventor 铃木贵光矶部雅哉久保胜
Owner ROHM CO LTD
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