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Heat conduction phase change composite material and preparation method thereof

A technology of composite materials and phase change materials, which is applied in the field of thermally conductive phase change composite materials and their preparation, can solve the problems of low thermal conductivity of thermally conductive silica gel, achieve the effects of enhancing thermal conductivity, increasing latent heat, and broad application prospects

Active Publication Date: 2017-03-08
东莞市兆科电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to provide a thermally conductive phase change composite material and its preparation method to solve the problem of low thermal conductivity of thermally conductive silica gel in the prior art

Method used

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  • Heat conduction phase change composite material and preparation method thereof

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Effect test

Embodiment 1

[0029] Prepare microcapsule phase-change materials with reference to the method of CN 105348797A, namely:

[0030] Add 4wt% graphene with a size of 0.9 μm to the molten n-tetradecane, pour it into a uniform 3wt% sodium dodecyl sulfate deionized aqueous solution under the condition of a 50°C water bath, and emulsify at a speed of 1500r / min 30min, while purging with nitrogen;

[0031] Add a polylactic acid-polyethylene glycol block polymer with a number average molecular weight of 8000 to the emulsified solution, stir for 30 minutes at a speed of 250 r / min, centrifuge and dry to obtain white particles, which are microparticles with a core-shell structure. Encapsulated phase change materials.

[0032] Graphene with a size of 0.9 μm and carbon nanotubes are mixed at a mass ratio of 1:3 to obtain thermally conductive fillers.

[0033] The thermally conductive filler and the microcapsule phase change material are mixed at a mass ratio of 1:9 to obtain a thermally conductive phase ...

Embodiment 2

[0036] Add 5wt% graphene with a size of 0.8 μm to the molten n-pentadecane, pour it into a uniform 3wt% sodium dodecyl sulfate deionized aqueous solution under the condition of a 50°C water bath, and emulsify at a speed of 1500r / min 40min, while purging with nitrogen;

[0037] Add a polylactic acid-polyethylene glycol block polymer with a number average molecular weight of 8500 to the emulsified solution above, stir for 30 minutes at a speed of 250 r / min, centrifuge and dry to obtain white particles, which are microparticles with a core-shell structure. Encapsulated phase change materials.

[0038] Graphene with a size of 0.8 μm and carbon nanotubes are mixed at a mass ratio of 1:2.5 to obtain thermally conductive fillers.

[0039] The thermally conductive filler and the microcapsule phase change material are mixed at a mass ratio of 1:8 to obtain a thermally conductive phase change material.

[0040] Mix the above-mentioned thermally conductive phase-change material with EV...

Embodiment 3

[0042] Add 6wt% graphene with a size of 1 μm to the molten n-hexadecane, pour it into a uniform 3wt% sodium dodecyl sulfate deionized aqueous solution under the condition of a water bath at 50°C, and emulsify at 1500r / min for 30 -40min, while purging with nitrogen;

[0043] Add a polylactic acid-polyethylene glycol block polymer with a number average molecular weight of 9000 to the emulsified solution above, stir for 30 minutes at a speed of 250 r / min, centrifuge and dry to obtain white particles, which are microparticles with a core-shell structure. Encapsulated phase change materials.

[0044] Graphene with a size of 1 μm and carbon nanotubes are mixed at a mass ratio of 1:2 to obtain thermally conductive fillers.

[0045] The thermally conductive filler and the microcapsule phase change material are mixed at a mass ratio of 1.2:8.4 to obtain a thermally conductive phase change material.

[0046] Mix the above-mentioned thermally conductive phase-change material with the m...

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Abstract

The invention provides a heat conduction phase change composite material and a preparation method thereof. The heat conduction phase change composite material comprises a substrate material and a heat conduction phase change material dispersed in the substrate material, wherein the heat conduction phase change material comprises a heat conduction filling material and a microcapsule phase change material; the heat conduction filling material is a mixture of grapheme and carbon nanometer tubes. The heat conducting filling material, the microcapsule phase change material and the substrate material are used for preparing the heat conduction phase change composite material by a method of being mixed, defoamed and then cured. The heat conduction filling material formed by the grapheme and the carbon nanometer tubes is added into the substrate material; the agglomeration phenomenon of the grapheme can be reduced; in addition, the grapheme and the carbon nanometer tubes are matched in a specific proportion; the heat conductivity of the composite material can be enhanced in a cooperated way, so that the heat conductivity can reach 15 to 20w / (m*K); the microcapsule phase change material is added into the substrate material, so that the latent heat of the composite material is improved; the stored energy can be as high as 90 to 98 KJ / kg.

Description

technical field [0001] The invention relates to the field of heat-conducting phase-change materials, in particular to a heat-conducting phase-change composite material and a preparation method thereof. Background technique [0002] Thermally conductive silicone is a high-end thermally conductive compound, which can avoid risks such as short circuits due to its non-solidification and non-conductive properties. Moreover, the high bonding performance and super heat conduction effect of thermally conductive silica gel are currently the best heat conduction solution when the CPU, GPU and heat sink are in contact. [0003] Thermally conductive silica gel is uniformly filled in the polymer matrix material with thermally conductive fillers to improve its thermal conductivity. Commonly used high thermal conductivity fillers are mainly ceramics and metals. However, the filling of these traditional thermally conductive fillers has many disadvantages. For example, a high filling amoun...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/08C08L91/06C08K3/04C08K7/24C08K9/10C08K13/06
CPCC08K3/04C08K7/24C08K9/10C08K2201/011C08L23/0853C08L91/06C08K13/06
Inventor 廖志盛
Owner 东莞市兆科电子材料科技有限公司
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